Photovoltaics

In collaboration with Dr. Minseo Park (Department of Physics, Auburn University), we are investigating multiple fabrication methods and configurations of advanced / flexible photovoltaics. We are developing and characterizing our unique structures (including alternative configurations, hybrid organic/inorganic, and sensitized with various...

Read More

TSV

With the help of Charles Ellis in the AMNSTC, we have developed a reliable through-Si via (TSV) process that we are using in our in-house 2.5D / 3D packaging and integration. This technology uses PEALD deposited Ru seed layers and electroplated Cu TSVs. These structures exhibit excellent filling, high aspect ratio and excellent uniformity. Current efforts...

Read More

Alternative Electronics

Further topics of interest that we are currently investigating include MoS2 fabrication and MoS2 based (RF) FET structures, memristors/ReRAM for digital & analog circuit functionality, chaos-based communication schemes, and low temperature (cryo) electronics.

Read More