Auburn Nanosystems Group Dr. Michael C. Hamilton

Graduated Graduate Students

hamilton and gupta at graduation in 2021
Vaibhav Gupta, PhD, 2021 – Intel
Dissertation: Fabrication and Characterization of Flexible Thin-Film Superconducting Microwave Cables
ePortfolio
IEEE MTT-S / IMS 2017 PhD Student Sponsorship Initiative Recipient

::

keith krause 2021
Keith Krause, MSEE, 2021
Thesis: Simulation of Quantum Parametric Amplifiers

::

hamilton and goteti graduation 2019
Uday Sravan Goteti, PhD, 2019 – Post-Doc @ UCSD
Dissertation: Superconducting Digital Logic Families using Quantum Phase Slip Junctions
2019 Outstanding PhD Student of Auburn University
IMS 2016 PhD Student Sponsorship Initiative Recipient
2016 Outstanding Masters Student of Auburn University

::

IMG_0631
Simin Zou, PhD, 2018 – Applied Materials
Dissertation: Flexible Superconducting Microwave Interconnects and Connectors
2017 Outstanding Ph.D. Student of Auburn University
IMS 2016 PhD Student Sponsorship Initiative Recipient
2014 Outstanding Masters Student of Auburn University

::

zhangming_in_lab
Zhangming Zhou, PhD, 2017 – Qualcomm
Dissertation: Evaluation of Thick Film Materials for High Temperature Electronics Packaging

::

IMG_0635
George Hernandez, PhD, 2016 – Intel
Dissertation: Superconducting Flexible Cables For Cryogenic Applications

::

IMG_0636
Rujun Bai, PhD, 2016 – LAM Technology
Dissertation: Superconducting Resonators on Thin Film Flexible Substrates

::

Jinzi Cui, PhD, 2016 – Not Pictured – Intel
Dissertation : Materials for High Temperature Electronic Packaging

::

kyle_owen_2015
Kyle Owen, MSEE, 2016 – Dynetics
Thesis: Design and Simulation of Cryogenic Test Circuits

::


Will King, MSEE, 2016 – Burns & McDonnell
Thesis: Reliability and Modeling of 32nm SOI Transistors at Cryogenic Temperatures

::

fangyu1
Fang Yu, PhD – Qualcomm
Dissertation: Ag Sintering Die Attach for High Temperature Applications
2016 Auburn University Distinguished Dissertation

::

kunfang_wall
Kun Fang, PhD – Qualcomm
Dissertation: Thin Film Multichip Packaging for High Temperature Geothermal Application

::

phillip_bailey_grad
J. Phillip Bailey, PhD – MIT-Lincoln Laboratory
Dissertation: Digital Reverse Time Chaos and Matched Filter Decoding

::

pingye_aubie_2014 me_pingye_graduation_2014
Pingye Xu, PhD – On Semiconductor
Dissertation: Fabrication and characterization of compliant off-chip double helix and carbon nanotube interconnect

::

zhenzhen_shen_2014
Zhenzhen Shen, PhD – Baker Hughes
Dissertation: Die Attach for High Temperature Applications

::

IMG_0633
Uday Goteti (MSEE => PhD)
Thesis: SPICE model implementation of a quantum phase-slip junction
2016 Outstanding Masters Student of Auburn University

::

Ya Guo (MSEE)
Thesis: Designs of Substrate Integrated Waveguide (SIW) and Its Transition to Rectangular Waveguide

::

george hughes 2021
George Hughes (MSEE => PhD)
Thesis: Design, Fabrication, and Characterization of a Short Range Multi Band Frequency Jammer

::

IMG_0630
Jordan Hullett – MEE (non-thesis) – Harris

::

IMG_0635
George Hernandez (MSEE => PhD)
Thesis: Through Silicon Vias Using Liquid Metal Conductors for Reworkable Electronics

::

IMG_0631
Simin Zou (MSEE => PhD)
Thesis: Flexible Nonvolatile Cu/CuxO/Ag ReRAM Fabricated Using Ink-Jet Printing Technology
2014 Outstanding Masters Student of Auburn University

::

Srikanth Peddada
Srikanth Peddada – MSEE 2013 – Freescale
Thesis: Signal Integrity Analysis of Transmission Lines in Anisotropic Substrates for High-Speed Data Transmission

::

Alexander Pfeiffenberger
Alexander Pfeiffenberger – MSEE 2013 – Broadcom
Thesis: Dielectric Permittivity Measurements of Electronics Cooling Fluids

 

Last modified: October 27, 2021