The Auburn Nanotech Group and AMNSTC have incorporated a substantial set of electronics packaging and integration tools. This includes a surface mount technology line (SMT, for solder deposition, pick & place, solder reflow, etc.), die placement / attachment tools (i.e., a Suss FC150 Flip-Chip Bonder), vacuum reflow (SST 3150 High Vacuum Furnace), wirebonders, ovens & furnaces and associated packaging implementation and development tools. The lab also hosts multiple failure analysis tools, including cross-section dicing / grinding / polishing and an ion cross-section polishing system (Gatan) for sample preparation prior to imaging and characterization with various microscopy (optical and SEM) available on the Auburn University campus.
Last modified: October 10, 2017