Publications

2017

S. Zou, Y. Cao, V. Gupta, B. Yelamanchili,  J. A. Sellers, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “High-Quality Factor Superconducting Flexible Resonators Embedded in Thin-Film Polyimide HD-4110,” IEEE Trans. Appl. Supercond., vol. 27, no. 7, pp. 1-5 (2017). DOI: 10.1109/TASC.2017.2732281

Charge-based superconducting digital logic family using quantum phase-slip junctions, 13th European Conference on Applied Superconductivity (EUCAS2017), September 17-21, 2017, Geneva, Switzerland. <EUCAS2017>

Frontiers of Superconducting and Cryogenic Microwave Electronics, IEEE MTT-S 2017 International Microwave Symposium (IMS2017), June 4-9, 2017, Honolulu, HI, USA. Organized by: M. C. Hamilton and D. E. Oates. <link>

F. Yu, R. W. Johnson, and M. C. Hamilton, “Process Optimization of Pressure-Assisted Rapid Ag Sintering Die Attach for 300 °C Applications,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 7, no. 6, pp. 855-861 (2017). DOI: 10.1109/TCPMT.2017.2693919

F. Yu, J. Cui, Z. Zhou, K. Fang, R. W. Johnson, and M. C. Hamilton, “Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications,” IEEE Trans. Power Electron., vol. 32, no. 9, pp. 7083-7095 (2017). DOI: 10.1109/TPEL.2016.2631128

K. Yapabandara, V. Mirkhani, M. S. Sultan, B. Ozden, M. P. Khanal, M. Park, S. Wang, M. C. Hamilton, Y. Chung, D.-J. Kim, and M. H. Sk, “Study of device instability of bottom-gate ZnO transistors with sol-gel derived channel layers,” Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, vol 35, no. 3, pp. 03D104 (2017). DOI: 10.1116/1.4979321

V. Gupta, J. Sellers, C. Ellis, B. Yelamanchili, S. Zou, Y. Cao, D. Tuckerman, and M. Hamilton, “Minimizing Film Stress and Degradation in Thin-Film Niobium Superconducting Cables,” presented at IMAPS 13th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 7-9, 2017. Best Student Paper! (1st) <link>

K. Fang, F. Yu, R. W. Johnson, and M. C. Hamilton, “Thin-Film Flip-Chip Assembly for High-Temperature Geothermal Application,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 7, no. 2, pp. 193-200 (2017). DOI: 10.1109/TCPMT.2016.2641933

S. Zou, Y. Cao, R. Bai, G. A. Hernandez, V. Gupta,  J. A. Sellers,  C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Embedded Niobium using PI-2611 for Superconducting Flexible Cables,” MRS Advances, published online 31 January, 2017. DOI: 10.1557/adv.2017.131

G. A. Hernandez, R. Bai;, Y. Cao, J. A. Sellers; C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Microwave Performance Of Niobium/Kapton Superconducting Flexible Cables,” IEEE Trans. Appl. Supercond., vol. 27, no. 4, pp. 1-4 (2017). DOI: 10.1109/TASC.2016.2645683

S. Zou, R. Bai, G. A. Hernandez, V. Gupta,  J. A. Sellers, Y. Cao, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Influence of Fatigue and Bending Strain on Critical Currents of Niobium Superconducting Flexible Cables Containing Ti and Cu Interfacial Layers,” IEEE Trans. Appl. Supercond., vol. 27, no. 4, pp. 1-5 (2017). DOI: 10.1109/TASC.2016.2641239

R. Bai;, G. A. Hernandez, Y. Cao, J. A. Sellers; C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Microwave Loss Measurements of Copper-Clad Superconducting Niobium Microstrip Resonators on Flexible Polyimide Substrates,” IEEE Trans. Appl. Supercond., vol. 27, no. 4, pp. 1-7 (2017). DOI: 10.1109/TASC.2016.2631840

 

2016

S. Zou, Y. Cao, R. Bai, G. A. Hernandez, V. Gupta,  J. A. Sellers,  C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Embedded Niobium using PI-2611 for Superconducting Flexible Cables,” presented at the MRS Fall Meeting 2016, Boston, MA, November 27 – December 2, 2016.

M. P. Khanal, B. Ozden, K. Kim, S. Uprety, V. Mirkhani, L. Shen, K. Yapabandara, S. Wang, M. C. Hamilton, A. C. Ahyi and M. Park, “Effects of Gamma-Ray Irradiation on Electronic Characteristics of AlGaN/GaN Heterostructures,” presented at International Workshop on Nitride Semiconductors (IWN-2016), Orlando, FL, Oct. 2-7, 2016.

S. Zou, R. Bai, G. A. Hernandez, V. Gupta,  J. A. Sellers, Y. Cao, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Influence of Fatigue and Bending Strain on Critical Currents of Niobium Superconducting Flexible Cables Containing Ti and Cu Interfacial Layers,” presented at Applied Superconductivity Conference 2016 (ASC 2016), Denver, CO, Sep. 4-9, 2016.

V. Gupta, J. A. Sellers, C. D. Ellis, S. Zou, G. A. Hernandez, R. Bai;, Y. Cao, D. B. Tuckerman, and M. C. Hamilton, “Barrier Layers to Protect Nb Superconductivity in Thin Film Superconducting Flexible Cables,” presented at Applied Superconductivity Conference 2016 (ASC 2016), Denver, CO, Sep. 4-9, 2016.

G. A. Hernandez, R. Bai;, Y. Cao, J. A. Sellers; C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Microwave Performance Of Niobium/Kapton Superconducting Flexible Cables,” presented at Applied Superconductivity Conference 2016 (ASC 2016), Denver, CO, Sep. 4-9, 2016.

R. Bai;, G. A. Hernandez, Y. Cao, J. A. Sellers; C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Microwave Loss Measurements of Copper-Clad Superconducting Niobium Microstrip Resonators on Flexible Polyimide Substrates,” presented at Applied Superconductivity Conference 2016 (ASC 2016), Denver, CO, Sep. 4-9, 2016.

J. P. Bailey, A. N. Beal, R. N. Dean and M. C. Hamilton, “A Digital Matched Filter for Reverse Time Chaos,” Chaos 26 073108 (2016). DOI: 10.1063/1.4955269 (arXiv version: arXiv:1508.02645 [physics.data-an])

D. B. Tuckerman, M. C. Hamilton D. J. Reilly, R. Bai, G. A. Hernandez, J. M. Hornibrook,  J. A. Sellers, C. D. Ellis, “Flexible superconducting Nb transmission lines on thin film polyimide for quantum computing applications,” Supercond. Sci. Technol. 29 084007 (2016). DOI: 10.1088/0953-2048/29/8/084007  (arXiv version: arXiv:1606.04557 [cond-mat.supr-con]) One of the SUST Highlights of 2016

K. Fang, Z. Shen, R. W. Johnson, and M. C. Hamilton, “Thin-Film Multichip Packaging for High-Temperature Geothermal Application,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 6, no. 5, pp. 692-702 (2016). DOI: 10.1109/TCPMT.2016.2542137

P. Gnanachchelvi,  R. C. Jaeger, B. M. Wilamowski, G. Niu, S. Hussain, J. C. Suhling, and M. C. Hamilton, “Performance Enhancement in Bipolar Junction Transistors Using Uniaxial Stress on (100) Silicon,” IEEE Transactions on Electron Devices, vol. 63, no 7, pp. 2643-2649 (2016). DOI:  10.1109/TED.2016.2560899

P. Gnanachchelvi, B. M. Wilamowski, R. C. Jaeger, S. Hussain, J. C. Suhling, and M. C. Hamilton, “A 1D numerical model for rapid stress analysis in bipolar junction transistors,” Int. J. Numer. Model., vol. 29, no. 6, pp. 1161-1179 (2016). DOI:  10.1002/jnm.2177

R. Bai, G. A. Hernandez, Y. Cao, J. A. Sellers, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Cryogenic Microwave Characterization of Kapton Polyimide Using Superconducting Resonators,” presented at IEEE International Microwave Symposium 2016 (IMS2016), San Francisco, CA, May 22-27, 2016. DOI: 10.1109/MWSYM.2016.7539977

M. A. Peacock, C. K. Roy, S. Bhavnani, M. Hamilton, R. W. Johnson R. W. Knight and D. K. Harris, “Characterization of Vertically Aligned Carbon Nanotubes Arrays as Thermal Interface Materials,” International Journal of Heat and Mass Transfer, vol. 97, pp. 94-100 (2016). DOI: 10.1016/j.ijheatmasstransfer.2016.01.071

F. Yu, J. Cui, Z. Zhou, R. W. Johnson, and M. C. Hamilton, “Component Attachment with Pressureless Sintering for 300oC Applications,” presented at IMAPS HiTEC, Albuquerque, NM, May 10-12, 2016. DOI: 10.4071/2016-HITEC-226

F. Werner, B. Rhea, A. Beal, W. Abell, J Bailey, R. Harrison, R. Dean and M. Hamilton, “A Matched Filter Developed for Chaotic Waveforms,” presented at IMAPS 12th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 15-17, 2016. DOI: 10.4071/2016DPC-WP35

V. Gupta, J. Sellers, C. Ellis, S. Zou, G. Hernandez, R. Bai, Y. Cao, D. Tuckerman, and M. Hamilton, “Preserving Nb Superconductivity in Thin Film Flexible Structures,” presented at IMAPS 12th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 15-17, 2016. DOI: 10.4071/2016DPC-THA32

C. K. Roy, D. K. Harris, S. Bhavnani, M. C. Hamilton, W. Johnson and R. W. Knight, “Durability of Low Melt Alloys as Thermal Interface Materials,” Journal of Electronics Packaging, 138(1), 010913, March (2016). DOI: 10.1115/1.4032462

B. Ozden, M. P. Khanal, V. Mirkhani, K. Yapabandara, C. Yang, S. Ko, S. Youn, M. C. Hamilton, M. H. Sk, A. C. Ahyi, and M. Park, “Time-resolved photocurrent spectroscopy diagnostics of electrically active defects in AlGaN/GaN high electron mobility transistor (HEMT) structures grown on Si wafers,” Journal of Nanoscience and Nanotechnology, vol. 16, no. 7, pp. 7630-7634 (2016). DOI: 10.1166/jnn.2016.12590

V. Mirkhani, F. Tong, D. Song, Y. Chung, B. Ozden, K. Yapabandara, M. Hamilton, D.-J. Kim, H. Koo, K. K. Lee, and M. Park, “Simulation of the refractive index of Ga doped ZnO nanoparticles embedded in PEDOT:PSS using effective medium approximations,” Journal of Nanoscience and Nanotechnology, vol. 16, no. 7, pp. 7358-7362 (2016). DOI: 10.1166/jnn.2016.12400

Z. Shen, T. Xu, R. W. Johnson and M. C. Hamilton, “Lead-Free Solder for Assembly of Thick-Film Hybrid Modules for Use in High-Temperature Applications,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 6, no. 3, pp. 373-382 (2015). DOI: 10.1109/TCPMT.2015.2470533

 

2015

F. Yu, R. W. Johnson and M. C. Hamilton, “Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300oC Applications,” International Symposium on Microelectronics: FALL 2015, vol. 2015, no. 1, pp. 000654-000660, Orlando, FL, October 27-29, 2015. DOI: 10.4071/isom-2015-THA45

Z. Su, F. F. Dai, B. M. Wilamowski, M. Hamilton, W. Zhou, Y. Wang and J. Fu, “A 0.8~3GHz Wideband Folder Down-Converter with Noise Cancellation in 0.18um SiGe Technology,” 2015 IEEE Bipolar/BiCMOS Circuits and Technology Meeting – BCTM, pp. 105-108, Boston, MA, October 26-28, 2015. DOI: 10.1109/BCTM.2015.7340581

R. Jiang, F. F. Dai, F. Zhao, G. Niu, M. Hamilton, J. Fu, W. Zhou and Y. Wang, “Dual-band Quad-Core Transformer Coupled VCO with Phase Noise Optimization,” 2015 IEEE Bipolar/BiCMOS Circuits and Technology Meeting – BCTM, pp. 97-100, Boston, MA, October 26-28, 2015. DOI: 10.1109/BCTM.2015.7340579

R. C. Jaeger, S. Hussain, G. Niu, J. C. Suhling, B. M. Wilamowski, M. C. Hamilton and P. Gnanachchelvi, “Characterization of Residual Stress Levels in Complementary Bipolar Junction Transistors on (100) Silicon,” 2015 IEEE Bipolar/BiCMOS Circuits and Technology Meeting – BCTM, pp. 60-63, Boston, MA, October 26-28, 2015. DOI: 10.1109/BCTM.2015.7340582

C. K. Roy, S. Bhavnani, M. C. Hamilton, R. W. Johnson, R. W. Knight and D. K. Harris, “Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials,” Microelectronics Reliability, vol. 55, no. 12, part B, pp. 2698-2704 (2015). DOI: 10.1016/j.microrel.2015.08.020

F. Yu, R. W. Johnson and M. C. Hamilton, “Pressureless Sintering of Microscale Silver Paste for 300oC Applications,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 5, no. 9, pp. 1258-1264 (2015). DOI: 10.1109/TCPMT.2015.2455811

C. K. Roy, S. Bhavnani, M. C. Hamilton, R. W. Johnson, R. W. Knight and D. K. Harris, “Durability of low melt alloy as thermal interface material,” presented at Interpack, pp. V001T09A071, San Francisco, CA, July 6-9, 2015. DOI: 10.1115/IPACK2015-48083

J. Cui, R. W. Johnson and M. C. Hamilton, “Investigation into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach Reliability,” IMAPS HiTEN, Cambridge, UK, July 6-8, 2015. DOI: 10.4071/HiTEN-Session2-Paper2_6

C. K. Roy, S. Bhavnani, M. C. Hamilton, R. W. Johnson, J. L. Nguyen, R. W. Knight, D. K. Harris, “Investigation into the application of low melting temperature alloys as wet thermal interface materials,” Int. J. Heat and Mass Transf., vol. 85, pp. 996-1002 (2015). DOI: 10.1016/j.ijheatmasstransfer.2015.02.029

S. Wang, V. Mirkhani, K. Yapabandara, S. Ko, M. H. Sk, M. Park, and M. C. Hamilton, “Analysis of the Effect of Gamma-Ray Irradiation and Low-Temperature Characteristics of Sol-Gel Derived ZnO Thin-Film Transistors,” presented at the 73rd Device Research Conference, Columbus, Ohio, June 21-24, 2015. DOI: 10.1109/DRC.2015.7175611

B. Spearman, A. J. Hodge, J. Porter, J. G. Hardy, Z. Davis, T. Xu, X. Zhang, C. E. Schmidt, M. C. Hamilton and E. A. Lipke, “Conductive interpenetrating networks of polypyrrole and polycaprolactone encourage electrophysiological development of cardiac cells,” Acta Biomaterialia, vol. 28, pp. 109-120 (2015). DOI: 10.1016/j.actbio.2015.09.025

C. K. Roy, S. Bhavnani, M. C. Hamilton, R. W. Johnson, R. W. Knight, and D. K. Harris, “Application of Low Melt Alloys as Compliant Thermal Interface Materials: A Study of Performance and Degradation Under Thermal Duress,” Electronics Cooling, June, pp. 26-31 (2015). {Article}

U. S. Goteti and M. C. Hamilton, “SPICE model implementation of quantum phase-slip junctions,” Electronics Letters, 51 (13), pp. 979-981 (2015). DOI: 10.1049/el.2015.0904

J. Gess, S. Bhavnani, B. Ramakrishnan, R. W. Johnson, D. Harris, R. Knight, M. Hamilton, C. Ellis, “Liquid Immersion in the Data Center: A Modular Approach for Cooling High-Performance Microelectronics,” Electronics Cooling, March, pp. 30-35 (2015). {Article}

M. C. Hamilton and P. Xu, “Applications of Carbon Nanotubes for RF and Microwave Interconnects,” presented at 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (EMC&SI 2015), Santa Clara, CA, March 15-20, 2015.

P. Xu and M. Hamilton, “Design and Fabrication of MEMS-type Compliant Overhang Flip-chip Interconnect for RF Applications,” presented at IMAPS 11th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 17-19, 2015. DOI: 10.4071/2015DPC-tha32

C. K. Roy, S. Bhavnani, M. Hamilton, R. W. Johnson, R. W. Knight and D. K. Harris, “Performance of low melt alloys as thermal interface materials,” presented at SEMI-THERM 31, San Jose, March 15-19, 2015. DOI: 10.1109/SEMI-THERM.2015.7100166

E. Decrossas, M. D. Glover, K. Porter, T. Cannon, T. Stegeman, N. Allen-McCormack, M. C. Hamilton, and H. A. Mantooth, “High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-On-Package Applications,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 5, no. 3, pp. 307-313 (2015). DOI: 10.1109/TCPMT.2015.2394234

P. Xu and M. C. Hamilton, “Solution-Deposited Carbon Nanotube Flip Chip Interconnect for High-Frequency Applications,” IEEE Microw. Compon. Lett., vol. 25, no. 4, pp. 229-231 (2015). DOI: 10.1109/LMWC.2015.2400926

Z. Shen, R. W. Johnson, and M. C. Hamilton, “SiC Power Device Die Attach for Extreme Environments,” IEEE Trans. Electron Devices, vol. 62, no. 2, pp. 346-353 (2015). DOI: 10.1109/TED.2014.2358206

 

2014

Z. Shen, K. Fang, R. W. Johnson, and M. C. Hamilton, “Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 4, no. 11, pp. 1778-1784 (2014). DOI: 10.1109/TCPMT.2014.2345500

J. P. Bailey, A. N. Beal, R. N. Dean, M. C. Hamilton and J. K. Tugnait, “High-frequency reverse-time chaos generation using digital chaotic maps,” Electronics Letters,  50 (23), pp. 1683-1685 (2014). DOI: 10.1049/el.2014.2709

J. Akkara, U. Goteti, M. J. Palmer, R. C. Jaeger, M. C. Hamilton, and J. C. Suhling, “Characterization of thermally induced stress in IC packages using PiFETs over a temperature range of -180oC and 80oC,” presented at 47th International Symposium on Microelectronics, IMAPS 2014, San Diego, CA, October 14-16, 2014. DOI: 10.4071/isom-WA46

U. S. Goteti, F. J. Akkara, R. C. Jaeger, M. C. Hamilton, and J. C. Suhling, “Packaging induced die stress characterization using van der Pauw sensors between temperatures -180oC and 80oC,” presented at 47th International Symposium on Microelectronics, IMAPS 2014, San Diego, CA, October 14-16, 2014. DOI: 10.4071/isom-WA43

R. N. Dean, M. C. Hamilton and M. E. Baginski, “Capacitive fringing field moisture sensors implemented in flexible printed circuit board technology,” IMAPS Journal of Microelectronics and Electronic Packaging, Vol. 11, No. 3, pp. 122-127, 2014. DOI: 10.4071/imaps.415

S. Dhar, A. Modic, Y. Xu, A. C. Ahyi, Y. Zhou, P. Xu, M. C. Hamilton, J.R. Williams and L. C. Feldman, “High channel Mobility 4H-SiC MOSFETs by Antimony counter-doping,” IEEE Electron Device Lett., vol. 35, no. 9, pp. 894-896 (2014). DOI: 10.1109/LED.2014.2336592

P. Xu, F. Tong, V. A. Davis, M. Park and M. C. Hamilton, “Solution-based fabrication of carbon nanotube bumps for flip-chip interconnects,” IEEE Trans. Nanotechnol., vol. 13, no. 6, pp. 1118-1126 (2014). DOI: 10.1109/TNANO.2014.2340132

C. D. Ellis, M. C. Hamilton, J. R. Nakamura, and B. M. Wilamowski, “Efficient Determination of Copper Electroplating Chemistry Additives,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 4, no. 8, pp. 1380-1390 (2014). DOI: 10.1109/TCPMT.2014.2325941

M. Glover, E. Decrossas, K. Porter, H. A. Mantooth, M. C. Hamilton, A. H. Pfeiffenberger, E. J. Myers, “Low loss power distribution in hybrid thin film on LTCC,” Advancing Microelectronics, vol. 41, no. 2, pp. 10-15, Mar/Apr (2014). FEATURED ARTICLE!

F. Tong, Y. Chung, J. Goswami, V. Davis, M. Hamilton, D.-J. Kim, H. Koo, K. K. Lee and M. Park, “Surface plasmon resonance properties of DC magnetron sputtered Ag nanoislands on ITO-glass and In2O3-PET substrates,” Electronics Letters,  50 (8), pp. 623-634 (2014). DOI: 10.1049/el.2014.0442

T. Stegeman, A. H. Pfeiffenberger, J. P. Bailey and M. C. Hamilton, “Broadband characterization of engineered dielectric fluids using a microstrip ring resonator technique,” Electronics Letters,  50 (8), pp. 576-578 (2014). DOI: 10.1049/el.2014.0377

S. Zou and M. C. Hamilton, “Flexible non-volatile Cu/CuxO/Ag ReRAM memory devices fabricated using ink-jet printing technology,” presented at IEEE ECTC  2014, Orlando, FL, May 27-30, 2014. DOI: 10.1109/ECTC.2014.6897321

P. Xu and M. C. Hamilton, “Compliant double helix interconnects for high frequency applications,” presented at IEEE ECTC  2014, Orlando, FL, May 27-30, 2014. DOI: 10.1109/ECTC.2014.6897424

S. Hussain, R. C. Jaeger, J. C. Suhling, B. M. Wilamowski, M. C. Hamilton, P. Gnanachchelvi, “Understanding the Impact of Temperature Variations on Measurement of the Stress Dependent Parameters of Bipolar Junction Transistors,” presented at 14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, May 27-30, 2014. DOI: 10.1109/ITHERM.2014.6892423

J. Gess, S. Bhavnani, K. A. Moores, B. Ramakrishnan, R. W. Johnson, D. Harris, R. Knight, M. Hamilton, C. Ellis, “Impact of Surface Enhancements upon Boiling Heat Transfer in a Liquid Immersion Cooled High Performance Small Form Factor Server Model,” presented at 14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, May 27-30, 2014. DOI: 10.1109/ITHERM.2014.6892314

F. Yu, R. W. Johnson, and M. Hamilton, “Pressureless, Low Temperature Sintering of Micro-scale Silver Paste for Die Attach for 300oC Applications,” presented at IMAPS HiTEC, Albuquerque, NM, May 13-15, 2014. BEST PAPER! DOI: 10.4071/HITEC-WA21

Z. Shen, R. W. Johnson, and M. Hamilton, “Characterization of BiAgX Solder Paste on Thick Film for 200oC Applications,” presented at IMAPS HiTEC, Albuquerque, NM, May 13-15, 2014. DOI: 10.4071/HITEC-THA23

M. C. Hamilton, P. Xu, G. Hernandez, M. J. Palmer and C. D. Ellis, “Reworkable Interconnects using Alternative Materials,” presented at IMAPS New England 41st Symposium and Expo, Boxborough, MA, May 6, 2014.

S. Zou and M. C. Hamilton, “Ink-jet Printed Cu/CuxO/Ag ReRAM Memory Devices Fabricated on Flexible Substrates” presented at the MRS Spring Meeting 2014, San Francisco, CA, April 21-25, 2014. MRS Proceedings, 1692, mrss14-1692-cc11-04. DOI: http://dx.doi.org/10.1557/opl.2014.905

G. A. Hernandez, C. D. Ellis, M. Palmer, and M. C. Hamilton, “Liquid Metal Conductors For Reworkable Electronics,” presented at GOMACTech 2014 , Charleston, SC, March 31 – April 3, 2014.

F. Tong, B. Ozden, K. Yapabandara, C.-W. Yang, C. Yang, M. Khanal, C. Jiao, M. Goforth, A. Ahyi, M. Hamilton, G. Niu, D.A. Ewoldt, G. Chung and M. Park, “Investigation of AlGaN/GaN heterostructures on Si wafers via photo I-V measurement,” presented at 91st Annual Meeting of the Alabama Academy of Science, Auburn, AL, March 12-14, 2014.

A. N. Beal, J. Tatarchuk, C. Stevens, T. Baginski, M. Hamilton and R. N. Dean, “Design Considerations and Ring-down Characteristics of Micromachined, High Current Density Capacitors,” presented at IMAPS 10th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 11-13, 2014. Best Student Paper! (2nd) DOI: 10.4071/2014DPC-wa32

J. Gess, S. Bhavnani, K. A. Moores, B. Ramakrishnan, R. W. Johnson, D. Harris, R. Knight, M. Hamilton, C. Ellis, “Investigation and Characterization of a High Performance, Small Form Factor, Modular Liquid Immersion Cooled Server Model,” presented at IEEE 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM), San Jose, CA, March 9-13, 2014. DOI: 10.1109/SEMI-THERM.2014.6892208

P. Xu, A. H. Pfeiffenberger, C. D. Ellis, and M. C. Hamilton, “Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects,” IEEE J. Microelectromech. Syst., vol. 23, no. 5, pp. 1219-1227 (2014). DOI: 10.1109/JMEMS.2014.2309121

S. Hale, A. N. Beal, J. P. Bailey, R. N. Dean, J. K. Tugnait, N. J. Corron and M. Hamilton, “Design considerations for a high-capacity chaotic communications channel,” presented at XXXIII Dynamics Days US, Atlanta, GA, January 2-5, 2014.

 

2013

F. Tong, K. Yapabandara, C.-W. Yang, M. Khanal, C. Jiao, M. Goforth, B. Ozden, A. Ahyi, M. Hamilton, G. Niu, D.A. Ewoldt, G. Chung, and M. Park, “Spectroscopic photo I–V diagnostics of nitride-based high electron mobility transistor structures on Si wafers,” Electronics Letters, 49 (24), pp. 1547-1548 (2013). DOI: 10.1049/el.2013.3404

R. C. Jaeger, S. Hussain, J. C. Suhling, P. Gnanachchelvi, B. M. Wilamowski, and M. C. Hamilton, “Modeling the Impact of Mechanical Stress on Bipolar Transistor Current Gain and Early Voltage,” presented at IEEE Sensors, Baltimore, MD, November 3-6, 2013. DOI: 10.1109/ICSENS.2013.6688466

E. Decrossas, M. D. Glover, K. Porter, T. Cannon, M. C. Hamilton, and H. A. Mantooth, “Broad Frequency LTCC Vertical Interconnect Transition for MultiChip Modules and System On Package Applications,” presented at European Microwave Week (EuMW2013), Nuremberg, Germany, October 6-11, pp. 104-107, 2013.

M. Glover, M. Hamilton, E. Decrossas, K. Porter, A. Pfeiffenberger, and A. Mantooth, “A low loss power distribution network design in low temperature co-fired ceramic technology,” in Proceedings of the 46th International Symposium on Microelectronics, IMAPS 2013, Orlando, FL, September 30 – October 3, 2013. DOI: 10.4071/isom-2013-WP32

S. Hussain, P. Gnanachchelvi, J. C. Suhling, R. C. Jaeger, M. C. Hamilton and B. M. Wilamowski, “The Influence of Uniaxial Normal Stress on the Performance of Vertical Bipolar Transistors,” in Proceedings of the InterPACK2013, Burlingame, CA, July 16-28, 2013. DOI: 10.1115/IPACK2013-73233

Z. Shen, K. Fang, M. Hamilton, R. W. Johnson, E. Snipes and M. Bozack, “Lead-free Solder Attach for 200oC Applications,” in Proceedings of the International Conference on High Temperature Electronics Network (HiTEN 2013), Oxford, UK, July 8-10, pp. 260-267, 2013. DOI: 10.4071/HITEN-WA18

S.A. Hale, J.P. Bailey, A.N. Beal, R.N. Dean, M.C. Hamilton, “Hardware implementation of cellular automata on coupled networks of exactly solvable chaotic oscillators,” 2013 SIAM Conference on Applications of Dynamical Systems, Snowbird, UT, May 19-23, 2013.

A.N. Beal, J.P. Bailey, S.A. Hale, R.N. Dean, M.C. Hamilton, J.K. Tugnait, D.W. Hahs and N.J. Corron, ”Implementing an exactly solvable chaotic oscillator for chaos communications,” 2013 SIAM Conference on Applications of Dynamical Systems, Snowbird, UT, May 19-23, 2013.

S. Zou, P. Xu and M. C. Hamilton, “Resistive switching characteristics in printed Cu/CuO/(AgO)/Ag memristors,” Electronics Letters, 49 (13), pp. 829-830 (2013). FEATURED ARTICLE! DOI: 10.1049/el.2013.1302

G. A. Hernandez, S. Patenaude, D. Martinez, C. Ellis, M. Auad, and M. C. Hamilton, “Characterization of AL-X Carbon Resistors,” presented at IMAPS PNGND, Albany, April 30 – May 1, 2013.

S. Zou, P. Xu, and M. C. Hamilton, “Ink-jet Printed Cu/Ag Memristor,” presented at IMAPS PNGND, Albany, April 30 – May 1, 2013.

G. A. Hernandez, D. Martinez, C. Ellis, M. Palmer, and M. C. Hamilton, “Through Si Vias Using Liquid Metal Conductors For Re-workable 3D Electronics,” presented at IEEE ECTC, Las Vegas, NV, May 28-31, 2013. DOI: 10.1109/ECTC.2013.6575756

J. Bailey, M. Glover, E. Decrossas, K. Porter, T. Cannon, A. Mantooth, and M. Hamilton, “Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques,” presented at IMAPS CICMT 2013, Orlando, FL, April 23-25, 2013. DOI: 10.4071/CICMT-2013-TP23

B. Caudle, M. Baginski, and M. Hamilton, “Nonlinear Transmission Lines Using Substrate Integrated Waveguides in LTCC,” presented at IMAPS CICMT 2013, Orlando, FL, April 23-25, 2013. DOI: 10.4071/CICMT-TP25

B. Caudle, M. Baginski, H. Kirkici and M. C. Hamilton, “Three-Dimensional FDTD Simulation of Nonlinear Ferroelectric Materials in Rectangular Waveguide,” IEEE Trans. Plasma Science, 41, no. 2, pp. 365-370 (2013). DOI: 10.1109/TPS.2013.2239663

P. Xu and M. C. Hamilton, “Reduced-Loss Ink-Jet Printed Flexible CPW with Copper Coating,” IEEE Microw. Compon. Lett., 23, no. 4, pp. 178-180 (2013). DOI: 10.1109/LMWC.2013.2248704

G. A. Hernandez, D. Martinez, S. Patenaude, and M. C. Hamilton, “Nanostructured Amorphous Silicon on Metal Electrodes: Electrical and Optical Properties,” Proceedings of the 2013 MRS Spring Meeting, San Francisco, CA, April, 2013. MRS Proceedings, 1551, pp 61-66. DOI: http://dx.doi.org/10.1557/opl.2013.897

M. Hamilton, J. Bailey, C. Ellis, M. Palmer, T. Issac-Smith and R. Wayne Johnson, “Redistribution Layers Based on Thin-Film AL-X / Cu and Si Interposers with Cu TSVs for Dense 28Gbps Chip-to-Chip Networks,” presented at GOMACTech 2013, Las Vegas, NV, March 11-14, 2013.

G. A. Hernandez, D. Martinez, S. Patenaude, C. Ellis, M. Palmer and M. C. Hamilton, “Through Si Vias Using Liquid Metal Conductors for Re-workable 3D Electronics,” presented at IMAPS 9th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March, 2013.

A. N. Beal, C. Stevens, T. Baginski, M. C. Hamilton and R. N. Dean, “Design, Simulation and Testing of High Density, High Current Micro-machined Embedded Capacitors,” presented at 9th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March, 2013. DOI: 10.4071/2013DPC-ta32

 

2012

P. Xu and M. C. Hamilton, “Indium plated carbon nanotubes pattern on flexible substrate defined by ink-jet printing,” Proceedings of the 2012 MRS Fall Meeting, Boston, Nov., 2012.  MRS Proceedings, 1505, mrsf12-1505-w13-12-ww07-12. DOI: http://dx.doi.org/10.1557/opl.2013.265

A. N. Beal, J. P. Bailey, S. A. Hale, R. N. Dean, M. Hamilton, J. K. Tugnait, D. W. Hahs and N. J. Corron, “Design and Simulation of a High Frequency Exact Solvable Chaotic Oscillator,” MILCOM12, October 29 – November 1, 2012. DOI: 10.1109/MILCOM.2012.6415803

M. C. Hamilton, “Recent Advances in Energy Harvesting,” IECON 2012, Montreal, Canada, October, 2012. DOI: 10.1109/IECON.2012.6389019

J. Bailey, A. Pfeiffenberger, C. Ellis, M. Palmer, T. Isaac-Smith and M. Hamilton, “Thin-Film Signal and Power Redistribution Layers Based on AL-X and Cu,” Proc. 45th International Symposium on Microelectronics, IMAPS, San Diego, September, 2012. Best Student Paper! (1st)
DOI: 10.4071/isom-2012-TP26

G. A. Hernandez, P. Xu and M. C. Hamilton, “Fabrication and Electrical Characterization of Amorphous Black Silicon on Metal Electrodes,” presented at IMAPS PNGND, Albany, June 14-15, 2012. Best Student Paper! (2nd)

P. Xu and M. C. Hamilton, “ RF Performance of In-coated CNT Flexible Interconnect,” presented at IMAPS PNGND 2012, Albany, June 14-15, 2012. Best Student Paper! (1st)

P. Xu and M. C. Hamilton, “In-coated Carbon Nanotubes for Flexible Interconnects,” 8th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March, 2012. DOI: 10.4071/2012DPC-tp23

J. Richard, R. Dean and M. Hamilton, “Testing of Flexible Metamaterials RF Filters Implemented through Micromachining LCP Substrates,” 8th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March, 2012. DOI: 10.4071/2012DPC-tp35

A. Beal, T. Baginski, M. Hamilton, C. Stevens and R. Dean, “Micro-machined High Density Embedded Capacitor Technologies for Silicon Interposers,” 8th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March, 2012. Best Student Paper! (3rd) DOI: 10.4071/2012DPC-tp42

 

2011 and prior

H. Yu, T. Xie, M. Hamilton and B. Wilamowski, “Comparison of Different Neural Network Architectures for Digit Image Recognition,” Proc. IEEE Human System Interaction Conference HSI 2011, Yokohama, Japan, May 19-21, 2011. DOI: 10.1109/HSI.2011.5937350

M. C. Hamilton and J. Kanicki, “Photodischarge characterization of defect states in polyfluorene-based organic field-effect transistors,” in preparation.

M. C. Hamilton and J. Kanicki, “Continuous and Pulsed Gate Bias Stressing of Polyfluorene-Based Organic Field-Effect Transistors,” in preparation.

M.C. Hamilton and J. Kanicki, “Time and Temperature Dependance of the Drain Current of PF-based OFETs,” Device Research Conference Digest, 2005. DRC ’05. 63rd , vol.1, no., pp. 139- 140, 2005.

J. Kanicki, E. Cagin, M. Hamilton, H. Lee and P. Shea, “Organic Field-Effect Transistors for Flat-Panel Displays,” 2005 SID (Society for Information Display) Int. Symposium Seminar Lecture Notes, pp. M-10/1 – M-10/46, 2005 (ISSN 0887-915X).

M. C. Hamilton, S. Martin, and J. Kanicki, “Thin-film Organic Polymer Phototransistors,” IEEE Transactions on Electron Devices, vol. 51, pp. 877-885, 2004. DOI: 10.1109/TED.2004.829619

M. C. Hamilton and J. Kanicki “Organic Polymer Thin-film Transistor Photosensors,” IEEE Journal of Selected Topics in Quantum Electronics, vol. 10, pp. 840-848, 2004. DOI: 10.1109/JSTQE.2004.833972

M. C. Hamilton, S. Martin, and J. Kanicki, “Field-Effect Mobility of Organic Polymer Thin-Film Transistors,” Chemistry of Materials, vol. 16, pp. 4699-4704, 2004. DOI: 10.1021/cm049613r

M. C. Hamilton, S. Martin and J. Kanicki, “Effect of Illumination on Organic Polymer Thin-Film Transistors,” Mat. Res. Soc. Symp. Proc., vol. 771, pp. 333-338, 2003

S. Martin, M. Hamilton and J. Kanicki, “Source / Drain Contacts in Organic Polymer Thin Film Transistors,” Mat. Res. Soc. Symp. Proc., vol. 771, pp. 163-168, 2003.

M.C. Hamilton, S. Martin and J. Kanicki, “Organic Polymer Thin-Film Photo-Transistors,” Proc. of SPIE, vol. 5217, pp. 193-201, 2003

S. Martin, L. Dassas, M.C. Hamilton and J. Kanicki, “Time Dependence of Organic Polymer Thin-Film Transistors Current,” Proc. of SPIE, vol. 5217, pp. 7-15, 2003.

S. Martin, M. C. Hamilton, and J. Kanicki, “Organic-polymer thin-film transistors for active-matrix flat-panel displays?,” Journal of the Society for Information Display, vol. 11, pp. 543-549, 2003.

M.C. Hamilton, S. Martin and J. Kanicki, “Effect of Monochromatic Illumination on Organic Polymer Thin-Film Transistors,” IDRC 03 (Int. Display Research Conf.), pp. 14-17, 2003

S. Martin, L. Dassas, M. Hamilton and J. Kanicki, “Electrical Instabilities of Organic Polymer Thin-Film Transistors,” IDRC 03 (Int. Display Research Conf.), pp. 22-25, 2003.

M. C. Hamilton, S. Martin, and J. Kanicki, “Organic Polymer Phototransistors,” Electronic Materials Conference (EMC), 2002.

J. D. Cressler, M. Hamilton, R. Krithivasan, H. Ainspan, R. Groves, G. Niu, S. Zhan, Z. Jin, C. Marshall, P. Marshall, H. Kim, R. Reed, M. Palmer, A. Joseph, and D. Harame, “Proton Response of SiGe HBT Analog and RF Circuits and Passives,” IEEE Transactions on Nuclear Science, vol. 48, pp. 2238-2243, 2001. DOI: 10.1109/23.983202

J. D. Cressler, M. C. Hamilton, G. S. Mullinax, Y. Li, G. F. Niu, C. J. Marshall, P. W. Marshall, H. S. Kim, M. J. Palmer, A. J. Joseph, and G. Freeman, “The Effects of Proton Irradiation on the Lateral and Vertical Scaling of UHV/CVD SiGe HBT BiCMOS Technology,” IEEE Transactions on Nuclear Science, vol. 47, pp.2515-2520, 2000. DOI: 10.1109/23.903801