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  • 14:50, 8 March 2019HD-4100 (hist)[478 bytes]Vzg0006 (Talk | contribs) (Created page with "== HD 4100 Processing Guidelines== === Process for 4-5 µm thick HD 4100 photoresist thickness on '''Fused Si''' === # Dehydration Bake: 110 ˚C for 30 mins # Spin speed: Spre...")
  • 14:49, 8 March 2019HD-4110 (hist)[477 bytes]Vzg0006 (Talk | contribs) (Created page with "== HD 4110 Processing Guidelines== === Process for 20 µm thick HD 4110 photoresist thickness on '''Fused Si''' === # Dehydration Bake: 110 ˚C for 30 mins # Spin speed: Sprea...")
  • 14:36, 8 March 2019AZ 9245 (hist)[434 bytes]Vzg0006 (Talk | contribs) (Created page with "Dehydration Bake: 110 ˚C for 30 mins HMDS: 5 mins (not needed if coating PR on top of polyimide) Spin speed: Spread – 1700 RPM / 500 RPM/s / 5 sec, spin speed – 2200 RPM ...")
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