Tips

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The following serves as a guide on obtaining uniform plating across the wafer.

  • The anode bag should have RDL solution in it. Covering the anode completely.
  • The clip that holds the wafer should not be in the solution at all.
  • The area swabbed with acetone should not be in the solution either.
  • The stir rate should be set pretty high to agitate the solution.

Notes

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