2022
M. C. Hamilton, B. Yelamanchili, S. Peek, A. Shah, S. Bankson and C. Tillman, “Superconducting Microwave Interconnect Technologies for Quantum and Cryogenic Systems”, to be presented at IEEE MTT-S 2022 International Microwave Symposium (IMS2022), Denver, CO, USA, Jun. 19-24, 2022. Organized by: A. Boaventura and M. C. Hamilton. <IMS 2022>
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IMS 2022 Workshop: Emerging Low-Temperature/Cryogenic Microwave Techniques and Technologies for Quantum Information Processing, IEEE MTT-S 2022 International Microwave Symposium (IMS2022), Denver, CO, USA, June 19-24, 2022. <IMS 2022>
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A. Shah, S. E. Peek, V. Gupta, B. Yelamanchili, D. B. Tuckerman, C. Cantaloube, J. A. Sellers and M. C. Hamilton, “Superconducting Molybdenum Multi-Chip Module Approach for Cryogenic and Quantum Applications,” to be presented at IEEE ECTC 2022, San Diego, CA, May 31 – Jun. 3, 2022. <ECTC 2022>
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C. J. Lewis , J. D. Marchio, J. A. Sellers and M. C. Hamilton, “Return-Path Mueller Ellipsometry via Retroreflective Materials for Cryogenic Applications,” to be presented at MRS Spring Meeting 2022, Honolulu, HI, May 8 – 13, 2022 (virtual May 23 – 25, 2021). <MRS Spring Meeting 2022>
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S. E. Peek, G. Hughes, A. Shah, J. Ward, J. A. Sellers, M. Mahjouri-Samani, M. L. Adams and M. C. Hamilton, “Laser Processes Using Femtosecond Pulses for Cryogenic and Extreme Environment Device Fabrication,” to be presented at GOMACTech 2022, Miami, FL, Mar. 21 – Mar. 24, 2022. <GOMACTech>
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S. E. Peek, G. Hughes, J. A. Sellers, M. Mahjouri-Samani, M. L. Adams and M. C. Hamilton, “Laser Processing of Molybdenum Substrates and Polyimide Layers for Extreme Environment Electronics,” presented at IMAPS 18th International Conference and Exhibition on Device Packaging, Fountain Hills, AZ, March 7-10, 2022. <IMAPS DPC 2022>
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S. Wang, S. Uprety, D. Hanggi, V. Mirkhani, K. Yapabandara, M. P. Khanal, A. C. Ahyi, M. C. Hamilton, M. H. Sk, and M. Park, “The effect of gamma-ray irradiation on the electrical characteristics of sol-gel derived zinc tin oxide thin film transistors,” Solid-State Electronics, vol. 191, pp. 108270 (2022). doi: 10.1016/j.sse.2022.108270
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B. Yelamanchili, A. Shah, S. E. Peek, V. Gupta, J. A. Sellers, D. B. Tuckerman and M. C. Hamilton, “Face-To-Face Cable Interconnect Scheme for Thin Flexible Superconducting Stripline Cables”, IEEE Trans. Appl. Supercond., vol. 32, no. 4, pp. 1-5 (2022). doi: 10.1109/TASC.2022.3149729
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P. Fathi-Hafshejani, N. Azam, L. Wang, M. A. Kuroda, M. C. Hamilton, S. Hasim, and M. Mahjouri-Samani. “Monolayer WSe2 Field-Effect Transistor Biosensor for Detecting COVID-19 Virus (SARS-CoV-2).” presented at SPIE Photonics West 2022, San Francisco, CA, Jan. 22 – 27, 2022. <MMM-INTERMAG 2022>
2021
S. E. Peek, J. Ward, S. Bankson, A. Shah, J. A. Sellers, M. Adams and M. C. Hamilton, “Additive Manufacturing and Characterization of Microstructures Using Two-Photon Polymerization for Use in Cryogenic Applications,” presented at the MRS Fall Meeting 2021, Boston, MA, Nov. 29 – Dec. 2, 2021 (virtual Dec. 6 – 8, 2021). <MRS Fall Meeting 2021>
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R. Cheng, U. S. Goteti, H. Walker, K. Krause, L. Oeding and M. C. Hamilton, “Toward Learning in Neuromorphic Circuits Based on Quantum Phase Slip Junctions,” Front. Neurosci., vol. 15, pp. 1470 (2021). doi: 10.3389/fnins.2021.765883
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L. Nguyen, M. Hamilton, C. S. Tan, A. Helmy, and R. Das, “Packaging and Interconnect Challenges for Different Quantum Environments,” panel at IEEE International Conference on Quantum Computing and Engineering (QCE21), virtual conference, Oct. 17 – 22, 2021. <QCE21>
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H. Dai, C. Kegerreis, D. W. Gamage, J. Egan, M. Nielsen, Y. Chen, D. Tuckerman, S. E. Peek, B. Yelamanchili, M. Hamilton, A. Herr and Q. Herr, “Isochronous Data Link Across a Superconducting Nb Flex Cable with 5 femtojoules per Bit,” arXiv preprint arXiv:2109.01808 [cond-mat.supr-con], 2021.
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B. Yelamanchili, A. Shah, S. E. Peek, V. Gupta, J. A. Sellers, D. B. Tuckerman and M. C. Hamilton, “Face-To-Face Cable Interconnect Scheme for Thin Flexible Superconducting Stripline Cables”, presented at the 15th European Conference on Applied Superconductivity (EUCAS2021), virtual conference, Sep. 5 – 9, 2021. <EUCAS2021>
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P. Fathi-Hafshejani, N. Azam, L. Wang, M. A. Kuroda, M. C. Hamilton, S. Hasim, and M. Mahjouri-Samani. “Two-Dimensional-Material-Based Field-Effect Transistor Biosensor for Detecting COVID-19 Virus (SARS-CoV-2).” ACS nano 15, no. 7, pp. 11461-11469 (2021). doi: 10.1021/acsnano.1c01188
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M. C. Hamilton, “Fabrication of Superconducting Devices for Entangled Microwave Photon Sources,” presented at SIAM Conference on Applied Algebraic Geometry (AG21), virtual conference, Aug. 16 – 20, 2021. <SIAM AG21>
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V. Mirkhani, S. Wang, K. Yapabandara, M. S. Sultan, M. P. Khanal, S. Uprety, B. Ozden, E. Hassani, B. V. Schoenek, D.-J. Kim, T.-S. Oh, A. C. Ahyi, S. Dhar, M. C. Hamilton, M. H. Sk, and M. Park, “High dose gamma irradiation effects on properties of active layers in ZnO thin film transistors,” Semi. Sci. Tech., vol. 36, no. 10, pp. 105011 (2021). doi: 10.1088/1361-6641/ac1c4e
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M. Park, M. C. Hamilton, S. Wang and K. Y. Bandara. “RADIATION HARDENED THIN-FILM TRANSISTORS.” U.S. Patent 11,069,815, issued July 20th, 2021.
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B. Yelamanchili, V. Gupta, S. Zou, R. Christiansen, M. C. Chichon, J. A. Sellers, M. Park, D. B. Tuckerman and M. C. Hamilton, “Microwave Characterization of Gamma Ray Irradiated Thin Film Embedded and Non-Embedded Nb Resonators,” presented at CEC/ICMC’21, virtual conference, Jul. 19 – 23, 2021. <CEC/ICMC’21>
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S. E. Peek, A. Shah, B. Yelamanchili, V. Gupta, J. A. Sellers, D. B. Tuckerman and M. C. Hamilton, “Approaches for High Performance and Thermally Optimized Flexible Cryogenic Microwave Ribbon Cables,” (invited) presented at CEC/ICMC’21, virtual conference, Jul. 19 – 23, 2021. <CEC/ICMC’21>
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V. Gupta, A. Shah, B. Yelamanchili, S. E. Peek, J. A. Sellers, D. B. Tuckerman and M. C. Hamilton, “SU-8 Microstructures on Molybdenum Substrates: Fabrication and Cryogenic Temperature Reliability,” presented at CEC/ICMC’21, virtual conference, Jul. 19 – 23, 2021. <CEC/ICMC’21>
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S. Bankson, B. Bottenfield, S. Liu, B. Pound, M. Adams, R. Candler, and M. C. Hamilton, “Performance of Custom, Chip-Level Magnetic Shielding at Cryogenic Temperatures,” presented at CEC/ICMC’21, virtual conference, Jul. 19 – 23, 2021. <CEC/ICMC’21>
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R. Cheng, U. S. Goteti and M. C. Hamilton, “High-speed and low-power superconducting neuromorphic circuits based on quantum phase-slip junctions,” IEEE Trans. Appl. Supercond., vol. 31, no. 5, pp. 1-8 (2021). doi: 10.1109/TASC.2021.3066194
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M. C. Hamilton, “Superconducting Interconnect Technologies for Cryogenic & Quantum Systems,” webinar for UC Riverside – Department of ECE Colloquium, May 17, 2021. <UCR – ECE Colloquium>
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M. C. Hamilton, “Packaging & Integration Technologies & Challenges for Cryogenic & Quantum Systems,” plenary for IMAPS Crossover Extravaganza – International Conference on High Temperature Electronics (HiTEC), Apr. 29, 2021. <IMAPS Crossover – HiTEC>
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M. C. Hamilton, “Packaging and Interconnect Technologies for Cryogenic and Quantum Systems,” webinar for Silicon Valley Area Chapter of IEEE EPS, Apr. 22, 2021. <IEEE EPS SVA Webinars>
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S. E. Peek, V. Gupta, B. Yelamanchili, A. Shah, J. A. Sellers, D. B. Tuckerman and M. C. Hamilton, “Fabrication and Flip-Chip Assembly Processes For Cryogenic Applications Using Indium-Indium and SAC-Indium Bump Connections on Flexible Interconnects,” presented at GOMACTech 2021, virtual conference, Mar. 29 – Apr. 1, 2021. <GOMACTech>
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A. Shah, V. Gupta, B. Yelamanchili, S. E. Peek, M. F. Chowdhury, A. S. Rashid, U. Goteti, J. A. Sellers, D. B. Tuckerman and M. C. Hamilton, “Towards cable-to-cable connectors for flexible thin-film superconducting transmission lines,” IEEE Trans. Appl. Supercond., vol. 31, no. 5, pp. 1-6 (2021). doi: 10.1109/TASC.2021.3062566
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B. Yelamanchili, V. Gupta, S. Zou, R. Christiansen, M. C. Cichon, J. A. Sellers, M. Park, M. Mahjouri-Samani, D. B. Tuckerman and M. C. Hamilton, “Radiation Effects on Thin Flexible Superconducting Cables,” IEEE Trans. Appl. Supercond., vol. 31, no. 5, pp. 1-5 (2021). doi: 10.1109/TASC.2021.3061048
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Emma R. Schmidgall, Flavio Griggio, George Thiel, Sherman E. Peek, Bhargav Yelamanchili, Archit Shah, Vaibhav Gupta, John A. Sellers, Michael C. Hamilton, David B. Tuckerman and Samuel d’Hollosy, “Reliability Characterization of a Flexible Interconnect for Cryogenic and Quantum Applications,” in IEEE International Reliability Physics Symposium (IRPS 2021), virtual conference, Mar. 21 – 25, 2021.
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V. Gupta, M. L. Adams, J. A. Sellers, N. Niedzweicki, N. Rush, D. B. Tuckerman and M. C. Hamilton, “Atomic Layer Deposited Materials as Barrier Layers for Preservation of Nb Superconductivity in Multilayered Thin-Film Structures,” IEEE Trans. Appl. Supercond., vol. 31, no. 5, pp. 1-4 (2021). doi: 10.1109/TASC.2021.3055752
2020
M. C. Hamilton and U. S. Goteti. “QUANTUM PHASE SLIP JUNCTION BASED ADIABATIC LOGIC CIRCUITS AND APPLICATIONS OF SAME.” U.S. Patent 10,879,906, issued December 29th, 2020.
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V. Gupta, M. L. Adams, J. A. Sellers, N. Niedzweicki, N. Rush, D. B. Tuckerman and M. C. Hamilton, “Atomic Layer Deposited Materials as Barrier Layers for Preservation of Nb Superconductivity in Multilayered Thin-Film Structures,” presented at Applied Superconductivity Conference 2020 (ASC 2020), virtual conference, Oct. 24 – Nov. 7, 2020.
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A. Shah, M. F. F. Chowdhury, V. Gupta, B. Yelamanchili, A. S. Rashid, S. Peek, U. S. Goteti, J. A. Sellers, D. B. Tuckerman and M. C. Hamilton, “Towards Cable-to-Cable Connectors for Flexible Thin-Film Superconducting Transmission Lines ,” presented at Applied Superconductivity Conference 2020 (ASC 2020), virtual conference, Oct. 24 – Nov. 7, 2020.
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B. Yelamanchili, V. Gupta, S. Zou, R. Christiansen, M. C. Cichon, J. A. Sellers, M. Park, M. Mahjouri-Samani, D. B. Tuckerman and M. C. Hamilton, “Radiation Effects on Thin Flexible Superconducting Cables,” presented at Applied Superconductivity Conference 2020 (ASC 2020), virtual conference, Oct. 24 – Nov. 7, 2020.
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R. Cheng, U. S. Goteti and M. C. Hamilton, “High-speed and low-power superconducting neuromorphic circuits based on quantum phase-slip junctions,” presented at Applied Superconductivity Conference 2020 (ASC 2020), virtual conference, Oct. 24 – Nov. 7, 2020.
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S. Elafandi, R. Christiansen, N. Azam, M. Cichon, M. Park, M. C. Hamilton and M. Mahjouri-Samani, “Monolayer 2D quantum materials subjected to gamma irradiation in high-vacuum for nuclear and space applications,” Appl. Phys. Lett., 116, 213105 (2020). doi: 10.1063/5.0006919
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M. C. Hamilton and U. S. Goteti. “SUPERCONDUCTING CIRCUIT DEVICE AND APPLICATIONS OF SAME.” U.S. Patent 10,637,479, issued April 28th, 2020.
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S. E. Peek, J. Dunaway, C. J. Lewis, N. Niedzwiecki and M. C. Hamilton, “Cryogenic Characterization and Model Optimization for 14 nm Bulk FinFETs,” was to be presented at GOMACTech 2020 , San Diego, CA, Mar. 16 – 19, 2020.
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M. C. Hamilton, “Electronics at Extreme Temperatures,” presented at 2020 NDIA Electronics Division Meeting, Jan. 28, 2020, Arlington, VA. <NDIA EDM 2020>
2019
V. Gupta, B. Yelamanchili, S. Zou, T. Isaacs-Smith, J. A. Sellers, D. B. Tuckerman and M. C. Hamilton, “Microwave Optimization of Connector Transitions For Superconducting Cables”, presented at the 14th European Conference on Applied Superconductivity (EUCAS2019), Sep. 1 – 5, 2019, Glasgow, Scotland. <EUCAS2019>
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R. Cheng, U. Goteti and M. C. Hamilton, “New superconducting neuromorphic circuits based on quantum phase-slip junctions”, presented at the 14th European Conference on Applied Superconductivity (EUCAS2019), Sep. 1 – 5, 2019, Glasgow, Scotland. <EUCAS2019>
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U. Goteti, R. Cheng and M. C. Hamilton, “Adiabatic logic circuits using quantum phase-slip junctions”, presented at the 14th European Conference on Applied Superconductivity (EUCAS2019), Sep. 1 – 5, 2019, Glasgow, Scotland. <EUCAS2019>
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M. C. Hamilton, “Recent Progress on Flexible Superconducting Integration Technology: Cables and Connectors,” presented at 2019 Cryogenic Engineering Conference and International Cryogenic Materials Conference, Jul. 21 – 25, 2019, Hartford, CT. <CEC-ICMC 2019>
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M. C. Hamilton, “Packaging Approaches for Cryo-Electronics,” presented at International Workshop on Cryogenic Electronics for Quantum Systems, Jun. 17 – 20, 2019, Fermilab, IL. <IWCEQS 2019>
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M. C. Hamilton, et al., “Flexible Superconducting Interconnect Technology for Future Cryogenic Electronics Systems,” presented at 23rd Annual Components for Military & Space Electronics Conference & Exhibition, Apr. 16 – 18, 2019, Los Angeles, CA. <CMSE 2019>
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R. Rodriguez, R. Morrison, M. C. Hamilton, and T. Green – Panel Discussion: Mil/Aerospace Talent Gap…How to Attract and Retain Young Engineers, held during 23rd Annual Components for Military & Space Electronics Conference & Exhibition, Apr. 16 – 18, 2019, Los Angeles, CA. <CMSE 2019>
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R. K. Gupta and M. C. Hamilton, “IEEE MTT-S 2018 Webinar Series: Speaker Biographies and Webinar Abstracts [Education News],” in IEEE Microwave Magazine, vol. 20, no. 3, pp. 93-100, March 2019.
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S. Peek, V. Gupta, B. Yelamanchili, T. Stegeman, T. Isaacs-Smith, J. A. Sellers, D. B. Tuckerman, and M. C. Hamilton, “Fabrication and Assembly Processes for Custom and Commercial Flip-Chip Connections to Fine Pitch In Bump Arrays,” presented at IMAPS 15th International Conference and Exhibition on Device Packaging, Fountain Hills, AZ, Mar. 4 – 7, 2019.
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S. Zou, B. Yelamanchili, V. Gupta, J. A. Sellers, T. Isaacs-Smith, D. B. Tuckerman, and M. C. Hamilton, “Low-Loss Cable-to-Cable Parallel Connection Method for Thin-Film Superconducting Flexible Microwave Transmission Lines,” Supercond. Sci. Technol., vol. 32, 075006 (2019). doi: 10.1088/1361-6668/ab1825
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U. S. Goteti, M. Denton, K. Krause, A. Stephen, J. A. Sellers, S. Sullivan, M. C. Hamilton, A. Wynn and S. K. Tolpygo, “Reliability Studies of Nb/AlOx/Al/Nb Josephson Junctions Through Accelerated-life Electrical Stress Testing,” IEEE Trans. Appl. Supercond., vol. 29, no. 5, pp. 1-5 (2019). doi: 10.1109/TASC.2019.2904593
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V. Gupta, B. Yelamanchili, S. Zou, T. Isaacs-Smith, J. A. Sellers, D. B. Tuckerman and M. C. Hamilton, “Thin-Film Nb/Polyimide Superconducting Stripline Flexible Cables,” IEEE Trans. Appl. Supercond., vol. 29, no. 5, pp. 1-5 (2019). doi: 10.1109/TASC.2019.2904203
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V. Gupta, B. Yelamanchili, S. Zou, T. Isaacs-Smith, J. A. Sellers, D. B. Tuckerman and M. C. Hamilton, “Distinguishing Dielectric Loss From Superconductor Loss Using Flexible Thin Film Superconducting Resonator Structures,” IEEE Trans. Appl. Supercond., vol. 29, no. 5, pp. 1-5 (2019). doi: 10.1109/TASC.2019.2902756
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U. S. Goteti and M. C. Hamilton, “Complementary quantum logic family using Josephson junctions and quantum phase-slip junctions,” IEEE Trans. Appl. Supercond., vol. 29, no. 5, pp. 1-5 (2019). doi: 10.1109/TASC.2019.2904695 (arXiv version: arXiv:1901.06606 [physics.app-ph])
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V. Mirkhani, K. Yapabandara, S. Wang, M. P. Khanal, S. Uprety, M. S. Sultan, B. Ozden, A. C. Ahyi, M. C. Hamilton, M. H. Sk, and M. Park, “On the anomaly in the electrical characteristics of thin film transistors with multi-layered sol-gel processed ZnO,” Thin Solid Films, vol. 672, pp. 152-156 (2019). doi: 10.1016/j.tsf.2019.01.015
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R. Cheng, U. S. Goteti and M. C. Hamilton, “Superconducting Neuromorphic Computing Using Quantum Phase-Slip Junctions,” IEEE Trans. Appl. Supercond., vol. 29, no. 5, pp. 1-5 (2019). doi: 10.1109/TASC.2019.2892111 (arXiv version: arXiv:1812.07503 [cs.ET])
2018
S. Uprety, D. Hanggi, K. Yapabandara, V. Mirkhani, M. P. Khanal, B. Schoenek, S. Dhar, M. Park, M. Hamilton, S. Wang, and W. E. Hames, “Enhancement of electrical characteristics of a-ZTO TFTs based on channel layers produced with alternating precursor concentration,” Electronics Letters, vol. 54, no. 22, pp. 1298-1300 (2018). doi: 10.1049/el.2018.5734
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K. Yapabandara, V. Mirkhani, S. Wang, M. P. Khanal, S. Uprety, T. Isaacs-Smith, M. C. Hamilton and M. Park, “Proton-induced displacement damage in ZnO thin film transistors: Impact of damage location,” Microelectronics Reliability, vol. 91, no. 2, pp. 262-268 (2018). doi: 10.1016/j.microrel.2018.10.011
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R. Cheng, U. S. Goteti and M. C. Hamilton, “Superconducting Neuromorphic Computing Using Quantum Phase-Slip Junctions,” presented at Applied Superconductivity Conference 2018 (ASC 2018), Seattle, WA, Oct. 28 – Nov. 2, 2018.
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U. S. Goteti, M. Denton, K. Krause, A. Stephen, J. A. Sellers, S. Sullivan, M. C. Hamilton, A. Wynn and S. K. Tolpygo, “Reliability Studies of Nb/AlOx/Al/Nb Josephson Junctions Through Accelerated-life Electrical Stress Testing,” presented at Applied Superconductivity Conference 2018 (ASC 2018), Seattle, WA, Oct. 28 – Nov. 2, 2018.
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U. S. Goteti and M. C. Hamilton, “Complementary quantum logic family using Josephson junctions and quantum phase-slip junctions,” presented at Applied Superconductivity Conference 2018 (ASC 2018), Seattle, WA, Oct. 28 – Nov. 2, 2018.
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V. Gupta, B. Yelamanchili, S. Zou, T. Isaacs-Smith, J. A. Sellers, D. B. Tuckerman, and M. C. Hamilton, “Distinguishing Dielectric Loss From Superconductor Loss Using Flexible Thin Film Superconducting Resonator Structures,” presented at Applied Superconductivity Conference 2018 (ASC 2018), Seattle, WA, Oct. 28 – Nov. 2, 2018.
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V. Gupta, B. Yelamanchili, S. Zou, T. Isaacs-Smith, J. A. Sellers, D. B. Tuckerman, and M. C. Hamilton, “Thin-film Nb/Polyimide Superconducting Stripline Flexible Cables,” presented at Applied Superconductivity Conference 2018 (ASC 2018), Seattle, WA, Oct. 28 – Nov. 2, 2018.
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R. Cheng, U. S. Goteti, and M. C. Hamilton, “Spiking neuron circuits using superconducting quantum phase-slip junctions,” J. Appl. Phys., vol. 124, pp. 152126 (2018). doi: 10.1063/1.5042421
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M. C. Hamilton and U. S. Goteti. “SUPERCONDUCTING QUANTUM LOGIC AND APPLICATIONS OF SAME.” U.S. Patent 9,998,122, issued June 12th, 2018.
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M. C. Hamilton, D. B. Tuckerman, V. Gupta, B. Yelamanchili, S. Zou, G. A. Hernendez, R. Bai, Y. Cao, J. A. Sellers, and C. D. Ellis, “Recent Progress on Flexible Superconducting Cables,” (invited) presented at The 14th International Workshop of High-Temperature Superconductors in High Frequency Field (HTSHFF 2018), Zao-Onsen, Yamagata, Japan, June 5-8, 2018. <HTSHFF 2018>
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Z. Zhou, R. W. Johnson, and M. C. Hamilton, “Mechanical Reliability of Thick Films for High-Temperature Packaging,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 8, no. 6, pp. 1003-1013 (2018). doi: 10.1109/TCPMT.2018.2833445
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Z. Zhou, J. Cui, F. Yu, R. W. Johnson, and M. C. Hamilton, “Evaluation of Thick Film Materials for High Temperature Packaging,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 8, no. 5, pp. 773-783 (2018). doi: 10.1109/TCPMT.2018.2814206
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R. Gupta and M. C. Hamilton, “MTT-S 2017 Webinar Series – Another Successful Year of Collaborative Learning [Education News],” IEEE Microwave Magazine, vol. 19, no. 2, pp. 100-101 (Mar-Apr 2018). doi: 10.1109/MMM.2017.2781159
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Z. Zhou, R. W. Johnson, and M. C. Hamilton, “Conduction Mechanism of Bi Doped Thick Film Dielectric in High Temperature Aging with Bias,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 8, no. 5, pp. 784-791 (2018). doi: 10.1109/TCPMT.2018.2809038
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U. S. Goteti and M. C. Hamilton, “Charge-based superconducting digital logic family using quantum phase-slip junctions,” IEEE Trans. Appl. Supercond., vol. 28, no. 4, pp. 1-4 (2018). doi: 10.1109/TASC.2018.2803123 (arXiv version: arXiv:1801.00715 [physics.app-ph])
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S. Wang, V. Mirkhani, K. Yapabandara, R. Cheng, G. Hernandez, M. P. Khanal, M. S. Sultan, S. Uprety, L. Shen, S. Zou, P. Xu, C. D. Ellis, J. A. Sellers, M. C. Hamilton, G. Niu, M. H. Sk, and M. Park, “Electrical characteristics and density of states of thin-film transistors based on sol-gel derived ZnO channel layers with different annealing temperatures,” J. Appl. Phys., vol. 123, no. 16, pp. 161503 (2018). doi: 10.1063/1.4990412
2017
J. Cui, R. W. Johnson, and M. C. Hamilton, “Reliability of Die Attach on DBC Substrates with Different Ni Surface Finishes Using BiAgX Solder,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 7, no. 12, pp. 1940-1950 (2017). doi: 10.1109/TCPMT.2017.2752368
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J. Cui, R. W. Johnson, and M. C. Hamilton, “Reliability of AuGe Die Attach on DBC Substrates with Different Ni Surface Finishes,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 7, no. 10, pp. 1598-1607 (2017). doi: 10.1109/TCPMT.2017.2733383
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S. Zou, Y. Cao, V. Gupta, B. Yelamanchili, J. A. Sellers, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “High-Quality Factor Superconducting Flexible Resonators Embedded in Thin-Film Polyimide HD-4110,” IEEE Trans. Appl. Supercond., vol. 27, no. 7, pp. 1-5 (2017). doi: 10.1109/TASC.2017.2732281
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U. Goteti and M. C. Hamilton, “Charge-based superconducting digital logic family using quantum phase-slip junctions”, presented at the 13th European Conference on Applied Superconductivity (EUCAS2017), September 17-21, 2017, Geneva, Switzerland. <EUCAS2017>
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H. Yang, T. Stegeman, R. Ji, M. Hamilton, J. Gao, and G. Flowers, “High frequency signal transmission across contact interface subjected to vibration induced fretting corrosion,” presented at 2017 IEEE Holm Conference on Electrical Contacts, September 10-13, 2017, Denver, CO, USA. doi: 10.1109/HOLM.2017.8088069
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IMS 2017 Workshop: Frontiers of Superconducting and Cryogenic Microwave Electronics, IEEE MTT-S 2017 International Microwave Symposium (IMS2017), Honolulu, HI, USA, June 4-9, 2017. Organized by: M. C. Hamilton and D. E. Oates. <IMS 2017>
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F. Yu, R. W. Johnson, and M. C. Hamilton, “Process Optimization of Pressure-Assisted Rapid Ag Sintering Die Attach for 300 °C Applications,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 7, no. 6, pp. 855-861 (2017). doi: 10.1109/TCPMT.2017.2693919
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F. Yu, J. Cui, Z. Zhou, K. Fang, R. W. Johnson, and M. C. Hamilton, “Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications,” IEEE Trans. Power Electron., vol. 32, no. 9, pp. 7083-7095 (2017). doi: 10.1109/TPEL.2016.2631128
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K. Yapabandara, V. Mirkhani, M. S. Sultan, B. Ozden, M. P. Khanal, M. Park, S. Wang, M. C. Hamilton, Y. Chung, D.-J. Kim, and M. H. Sk, “Study of device instability of bottom-gate ZnO transistors with sol-gel derived channel layers,” Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, vol 35, no. 3, pp. 03D104 (2017). doi: 10.1116/1.4979321
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V. Gupta, J. Sellers, C. Ellis, B. Yelamanchili, S. Zou, Y. Cao, D. Tuckerman, and M. Hamilton, “Minimizing Film Stress and Degradation in Thin-Film Niobium Superconducting Cables,” presented at IMAPS 13th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 7-9, 2017. Best Student Paper! (1st) <link> doi: 10.4071/2017DPC-THA3_Presentation4
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K. Fang, F. Yu, R. W. Johnson, and M. C. Hamilton, “Thin-Film Flip-Chip Assembly for High-Temperature Geothermal Application,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 7, no. 2, pp. 193-200 (2017). doi: 10.1109/TCPMT.2016.2641933
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S. Zou, Y. Cao, R. Bai, G. A. Hernandez, V. Gupta, J. A. Sellers, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Embedded Niobium using PI-2611 for Superconducting Flexible Cables,” MRS Advances, published online 31 January, 2017. doi: 10.1557/adv.2017.131
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G. A. Hernandez, R. Bai, Y. Cao, J. A. Sellers, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Microwave Performance Of Niobium/Kapton Superconducting Flexible Cables,” IEEE Trans. Appl. Supercond., vol. 27, no. 4, pp. 1-4 (2017). doi: 10.1109/TASC.2016.2645683
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S. Zou, R. Bai, G. A. Hernandez, V. Gupta, J. A. Sellers, Y. Cao, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Influence of Fatigue and Bending Strain on Critical Currents of Niobium Superconducting Flexible Cables Containing Ti and Cu Interfacial Layers,” IEEE Trans. Appl. Supercond., vol. 27, no. 4, pp. 1-5 (2017). doi: 10.1109/TASC.2016.2641239
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R. Bai, G. A. Hernandez, Y. Cao, J. A. Sellers, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Microwave Loss Measurements of Copper-Clad Superconducting Niobium Microstrip Resonators on Flexible Polyimide Substrates,” IEEE Trans. Appl. Supercond., vol. 27, no. 4, pp. 1-7 (2017). doi: 10.1109/TASC.2016.2631840
2016
S. Zou, Y. Cao, R. Bai, G. A. Hernandez, V. Gupta, J. A. Sellers, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Embedded Niobium using PI-2611 for Superconducting Flexible Cables,” presented at the MRS Fall Meeting 2016, Boston, MA, November 27 – December 2, 2016.
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R. Gupta and M. C. Hamilton, “MTT-S Education Committee Launches Successful 2016 Webinar Series [Education News],” IEEE Microwave Magazine, vol. 17, no. 11, pp. 84-91 (Nov. 2016). doi: 10.1109/MMM.2016.2601539
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M. P. Khanal, B. Ozden, K. Kim, S. Uprety, V. Mirkhani, L. Shen, K. Yapabandara, S. Wang, M. C. Hamilton, A. C. Ahyi and M. Park, “Effects of Gamma-Ray Irradiation on Electronic Characteristics of AlGaN/GaN Heterostructures,” presented at International Workshop on Nitride Semiconductors (IWN-2016), Orlando, FL, Oct. 2-7, 2016.
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S. Zou, R. Bai, G. A. Hernandez, V. Gupta, J. A. Sellers, Y. Cao, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Influence of Fatigue and Bending Strain on Critical Currents of Niobium Superconducting Flexible Cables Containing Ti and Cu Interfacial Layers,” presented at Applied Superconductivity Conference 2016 (ASC 2016), Denver, CO, Sep. 4-9, 2016.
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V. Gupta, J. A. Sellers, C. D. Ellis, S. Zou, G. A. Hernandez, R. Bai, Y. Cao, D. B. Tuckerman, and M. C. Hamilton, “Barrier Layers to Protect Nb Superconductivity in Thin Film Superconducting Flexible Cables,” presented at Applied Superconductivity Conference 2016 (ASC 2016), Denver, CO, Sep. 4-9, 2016.
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G. A. Hernandez, R. Bai, Y. Cao, J. A. Sellers, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Microwave Performance Of Niobium/Kapton Superconducting Flexible Cables,” presented at Applied Superconductivity Conference 2016 (ASC 2016), Denver, CO, Sep. 4-9, 2016.
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R. Bai, G. A. Hernandez, Y. Cao, J. A. Sellers, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Microwave Loss Measurements of Copper-Clad Superconducting Niobium Microstrip Resonators on Flexible Polyimide Substrates,” presented at Applied Superconductivity Conference 2016 (ASC 2016), Denver, CO, Sep. 4-9, 2016.
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J. P. Bailey, A. N. Beal, R. N. Dean and M. C. Hamilton, “A Digital Matched Filter for Reverse Time Chaos,” Chaos 26 073108 (2016). doi: 10.1063/1.4955269 (arXiv version: arXiv:1508.02645 [physics.data-an])
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D. B. Tuckerman, M. C. Hamilton, D. J. Reilly, R. Bai, G. A. Hernandez, J. M. Hornibrook, J. A. Sellers, C. D. Ellis, “Flexible superconducting Nb transmission lines on thin film polyimide for quantum computing applications,” Supercond. Sci. Technol. 29 084007 (2016). doi: 10.1088/0953-2048/29/8/084007 (arXiv version: arXiv:1606.04557 [cond-mat.supr-con]) One of the SUST Highlights of 2016
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K. Fang, Z. Shen, R. W. Johnson, and M. C. Hamilton, “Thin-Film Multichip Packaging for High-Temperature Geothermal Application,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 6, no. 5, pp. 692-702 (2016). doi: 10.1109/TCPMT.2016.2542137
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P. Gnanachchelvi, R. C. Jaeger, B. M. Wilamowski, G. Niu, S. Hussain, J. C. Suhling, and M. C. Hamilton, “Performance Enhancement in Bipolar Junction Transistors Using Uniaxial Stress on (100) Silicon,” IEEE Transactions on Electron Devices, vol. 63, no 7, pp. 2643-2649 (2016). doi: 10.1109/TED.2016.2560899
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P. Gnanachchelvi, B. M. Wilamowski, R. C. Jaeger, S. Hussain, J. C. Suhling, and M. C. Hamilton, “A 1D numerical model for rapid stress analysis in bipolar junction transistors,” Int. J. Numer. Model., vol. 29, no. 6, pp. 1161-1179 (2016). doi: 10.1002/jnm.2177
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R. Bai, G. A. Hernandez, Y. Cao, J. A. Sellers, C. D. Ellis, D. B. Tuckerman, and M. C. Hamilton, “Cryogenic Microwave Characterization of Kapton Polyimide Using Superconducting Resonators,” presented at IEEE International Microwave Symposium 2016 (IMS2016), San Francisco, CA, May 22-27, 2016. doi: 10.1109/MWSYM.2016.7539977
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M. A. Peacock, C. K. Roy, S. Bhavnani, M. Hamilton, R. W. Johnson R. W. Knight and D. K. Harris, “Characterization of Vertically Aligned Carbon Nanotubes Arrays as Thermal Interface Materials,” International Journal of Heat and Mass Transfer, vol. 97, pp. 94-100 (2016). doi: 10.1016/j.ijheatmasstransfer.2016.01.071
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F. Yu, J. Cui, Z. Zhou, R. W. Johnson, and M. C. Hamilton, “Component Attachment with Pressureless Sintering for 300 °C Applications,” presented at IMAPS HiTEC, Albuquerque, NM, May 10-12, 2016. doi: 10.4071/2016-HITEC-226
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F. Werner, B. Rhea, A. Beal, W. Abell, J Bailey, R. Harrison, R. Dean and M. Hamilton, “A Matched Filter Developed for Chaotic Waveforms,” presented at IMAPS 12th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 15-17, 2016. doi: 10.4071/2016DPC-WP35
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V. Gupta, J. Sellers, C. Ellis, S. Zou, G. Hernandez, R. Bai, Y. Cao, D. Tuckerman, and M. Hamilton, “Preserving Nb Superconductivity in Thin Film Flexible Structures,” presented at IMAPS 12th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 15-17, 2016. doi: 10.4071/2016DPC-THA32
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C. K. Roy, D. K. Harris, S. Bhavnani, M. C. Hamilton, W. Johnson and R. W. Knight, “Durability of Low Melt Alloys as Thermal Interface Materials,” Journal of Electronics Packaging, 138(1), 010913, March (2016). doi: 10.1115/1.4032462
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B. Ozden, M. P. Khanal, V. Mirkhani, K. Yapabandara, C. Yang, S. Ko, S. Youn, M. C. Hamilton, M. H. Sk, A. C. Ahyi, and M. Park, “Time-resolved photocurrent spectroscopy diagnostics of electrically active defects in AlGaN/GaN high electron mobility transistor (HEMT) structures grown on Si wafers,” Journal of Nanoscience and Nanotechnology, vol. 16, no. 7, pp. 7630-7634 (2016). doi: 10.1166/jnn.2016.12590
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V. Mirkhani, F. Tong, D. Song, Y. Chung, B. Ozden, K. Yapabandara, M. Hamilton, D.-J. Kim, H. Koo, K. K. Lee, and M. Park, “Simulation of the refractive index of Ga doped ZnO nanoparticles embedded in PEDOT:PSS using effective medium approximations,” Journal of Nanoscience and Nanotechnology, vol. 16, no. 7, pp. 7358-7362 (2016). doi: 10.1166/jnn.2016.12400
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Z. Shen, T. Xu, R. W. Johnson and M. C. Hamilton, “Lead-Free Solder for Assembly of Thick-Film Hybrid Modules for Use in High-Temperature Applications,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 6, no. 3, pp. 373-382 (2015). doi: 10.1109/TCPMT.2015.2470533
2015
F. Yu, R. W. Johnson and M. C. Hamilton, “Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300 °C Applications,” International Symposium on Microelectronics: FALL 2015, vol. 2015, no. 1, pp. 000654-000660, Orlando, FL, October 27-29, 2015. doi: 10.4071/isom-2015-THA45
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Z. Su, F. F. Dai, B. M. Wilamowski, M. Hamilton, W. Zhou, Y. Wang and J. Fu, “A 0.8~3GHz Wideband Folder Down-Converter with Noise Cancellation in 0.18um SiGe Technology,” 2015 IEEE Bipolar/BiCMOS Circuits and Technology Meeting – BCTM, pp. 105-108, Boston, MA, October 26-28, 2015. doi: 10.1109/BCTM.2015.7340581
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R. Jiang, F. F. Dai, F. Zhao, G. Niu, M. Hamilton, J. Fu, W. Zhou and Y. Wang, “Dual-band Quad-Core Transformer Coupled VCO with Phase Noise Optimization,” 2015 IEEE Bipolar/BiCMOS Circuits and Technology Meeting – BCTM, pp. 97-100, Boston, MA, October 26-28, 2015. doi: 10.1109/BCTM.2015.7340579
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R. C. Jaeger, S. Hussain, G. Niu, J. C. Suhling, B. M. Wilamowski, M. C. Hamilton and P. Gnanachchelvi, “Characterization of Residual Stress Levels in Complementary Bipolar Junction Transistors on (100) Silicon,” 2015 IEEE Bipolar/BiCMOS Circuits and Technology Meeting – BCTM, pp. 60-63, Boston, MA, October 26-28, 2015. doi: 10.1109/BCTM.2015.7340582
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C. K. Roy, S. Bhavnani, M. C. Hamilton, R. W. Johnson, R. W. Knight and D. K. Harris, “Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials,” Microelectronics Reliability, vol. 55, no. 12, part B, pp. 2698-2704 (2015). doi: 10.1016/j.microrel.2015.08.020
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F. Yu, R. W. Johnson and M. C. Hamilton, “Pressureless Sintering of Microscale Silver Paste for 300 °C Applications,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 5, no. 9, pp. 1258-1264 (2015). doi: 10.1109/TCPMT.2015.2455811
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C. K. Roy, S. Bhavnani, M. C. Hamilton, R. W. Johnson, R. W. Knight and D. K. Harris, “Durability of low melt alloy as thermal interface material,” presented at Interpack, pp. V001T09A071, San Francisco, CA, July 6-9, 2015. doi: 10.1115/IPACK2015-48083
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J. Cui, R. W. Johnson and M. C. Hamilton, “Investigation into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach Reliability,” IMAPS HiTEN, Cambridge, UK, July 6-8, 2015. doi: 10.4071/HiTEN-Session2-Paper2_6
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C. K. Roy, S. Bhavnani, M. C. Hamilton, R. W. Johnson, J. L. Nguyen, R. W. Knight, D. K. Harris, “Investigation into the application of low melting temperature alloys as wet thermal interface materials,” Int. J. Heat and Mass Transf., vol. 85, pp. 996-1002 (2015). doi: 10.1016/j.ijheatmasstransfer.2015.02.029
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S. Wang, V. Mirkhani, K. Yapabandara, S. Ko, M. H. Sk, M. Park, and M. C. Hamilton, “Analysis of the Effect of Gamma-Ray Irradiation and Low-Temperature Characteristics of Sol-Gel Derived ZnO Thin-Film Transistors,” presented at the 73rd Device Research Conference, Columbus, Ohio, June 21-24, 2015. doi: 10.1109/DRC.2015.7175611
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B. Spearman, A. J. Hodge, J. Porter, J. G. Hardy, Z. Davis, T. Xu, X. Zhang, C. E. Schmidt, M. C. Hamilton and E. A. Lipke, “Conductive interpenetrating networks of polypyrrole and polycaprolactone encourage electrophysiological development of cardiac cells,” Acta Biomaterialia, vol. 28, pp. 109-120 (2015). doi: 10.1016/j.actbio.2015.09.025
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C. K. Roy, S. Bhavnani, M. C. Hamilton, R. W. Johnson, R. W. Knight, and D. K. Harris, “Application of Low Melt Alloys as Compliant Thermal Interface Materials: A Study of Performance and Degradation Under Thermal Duress,” Electronics Cooling, June, pp. 26-31 (2015). {Article}
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U. S. Goteti and M. C. Hamilton, “SPICE model implementation of quantum phase-slip junctions,” Electronics Letters, 51 (13), pp. 979-981 (2015). doi:
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J. Gess, S. Bhavnani, B. Ramakrishnan, R. W. Johnson, D. Harris, R. Knight, M. Hamilton, C. Ellis, “Liquid Immersion in the Data Center: A Modular Approach for Cooling High-Performance Microelectronics,” Electronics Cooling, March, pp. 30-35 (2015). {Article}
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M. C. Hamilton and P. Xu, “Applications of Carbon Nanotubes for RF and Microwave Interconnects,” presented at 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (EMC&SI 2015), Santa Clara, CA, March 15-20, 2015.
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P. Xu and M. Hamilton, “Design and Fabrication of MEMS-type Compliant Overhang Flip-chip Interconnect for RF Applications,” presented at IMAPS 11th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 17-19, 2015. doi: 10.4071/2015DPC-tha32
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C. K. Roy, S. Bhavnani, M. Hamilton, R. W. Johnson, R. W. Knight and D. K. Harris, “Performance of low melt alloys as thermal interface materials,” presented at SEMI-THERM 31, San Jose, March 15-19, 2015. doi: 10.1109/SEMI-THERM.2015.7100166
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E. Decrossas, M. D. Glover, K. Porter, T. Cannon, T. Stegeman, N. Allen-McCormack, M. C. Hamilton, and H. A. Mantooth, “High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-On-Package Applications,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 5, no. 3, pp. 307-313 (2015). doi: 10.1109/TCPMT.2015.2394234
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P. Xu and M. C. Hamilton, “Solution-Deposited Carbon Nanotube Flip Chip Interconnect for High-Frequency Applications,” IEEE Microw. Compon. Lett., vol. 25, no. 4, pp. 229-231 (2015). doi: 10.1109/LMWC.2015.2400926
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Z. Shen, R. W. Johnson, and M. C. Hamilton, “SiC Power Device Die Attach for Extreme Environments,” IEEE Trans. Electron Devices, vol. 62, no. 2, pp. 346-353 (2015). doi: 10.1109/TED.2014.2358206
2014
Z. Shen, K. Fang, R. W. Johnson, and M. C. Hamilton, “Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 4, no. 11, pp. 1778-1784 (2014). doi: 10.1109/TCPMT.2014.2345500
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J. P. Bailey, A. N. Beal, R. N. Dean, M. C. Hamilton and J. K. Tugnait, “High-frequency reverse-time chaos generation using digital chaotic maps,” Electronics Letters, 50 (23), pp. 1683-1685 (2014). doi: 10.1049/el.2014.2709
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J. Akkara, U. Goteti, M. J. Palmer, R. C. Jaeger, M. C. Hamilton, and J. C. Suhling, “Characterization of thermally induced stress in IC packages using PiFETs over a temperature range of -180 °C and 80 °C,” presented at 47th International Symposium on Microelectronics, IMAPS 2014, San Diego, CA, October 14-16, 2014. doi: 10.4071/isom-WA46
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U. S. Goteti, F. J. Akkara, R. C. Jaeger, M. C. Hamilton, and J. C. Suhling, “Packaging induced die stress characterization using van der Pauw sensors between temperatures -180 °C and 80 °C,” presented at 47th International Symposium on Microelectronics, IMAPS 2014, San Diego, CA, October 14-16, 2014. doi: 10.4071/isom-WA43
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R. N. Dean, M. C. Hamilton and M. E. Baginski, “Capacitive fringing field moisture sensors implemented in flexible printed circuit board technology,” IMAPS Journal of Microelectronics and Electronic Packaging, Vol. 11, No. 3, pp. 122-127, 2014. doi: 10.4071/imaps.415
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A. Modic, G. Liu, A. C. Ahyi, Y. Zhou, P. Xu, M. C. Hamilton, J.R. Williams and L. C. Feldman, S. Dhar, “High channel Mobility 4H-SiC MOSFETs by Antimony counter-doping,” IEEE Electron Device Lett., vol. 35, no. 9, pp. 894-896 (2014). doi: 10.1109/LED.2014.2336592
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P. Xu, F. Tong, V. A. Davis, M. Park and M. C. Hamilton, “Solution-based fabrication of carbon nanotube bumps for flip-chip interconnects,” IEEE Trans. Nanotechnol., vol. 13, no. 6, pp. 1118-1126 (2014). doi: 10.1109/TNANO.2014.2340132
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C. D. Ellis, M. C. Hamilton, J. R. Nakamura, and B. M. Wilamowski, “Efficient Determination of Copper Electroplating Chemistry Additives,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 4, no. 8, pp. 1380-1390 (2014). doi: 10.1109/TCPMT.2014.2325941
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M. Glover, E. Decrossas, K. Porter, H. A. Mantooth, M. C. Hamilton, A. H. Pfeiffenberger, E. J. Myers, “Low loss power distribution in hybrid thin film on LTCC,” Advancing Microelectronics, vol. 41, no. 2, pp. 10-15, Mar/Apr (2014). FEATURED ARTICLE!
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F. Tong, Y. Chung, J. Goswami, V. Davis, M. Hamilton, D.-J. Kim, H. Koo, K. K. Lee and M. Park, “Surface plasmon resonance properties of DC magnetron sputtered Ag nanoislands on ITO-glass and In2O3-PET substrates,” Electronics Letters, 50 (8), pp. 623-634 (2014). doi: 10.1049/el.2014.0442
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T. Stegeman, A. H. Pfeiffenberger, J. P. Bailey and M. C. Hamilton, “Broadband characterization of engineered dielectric fluids using a microstrip ring resonator technique,” Electronics Letters, 50 (8), pp. 576-578 (2014). doi: 10.1049/el.2014.0377
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S. Zou and M. C. Hamilton, “Flexible non-volatile Cu/CuxO/Ag ReRAM memory devices fabricated using ink-jet printing technology,” presented at IEEE ECTC 2014, Orlando, FL, May 27-30, 2014. doi: 10.1109/ECTC.2014.6897321
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P. Xu and M. C. Hamilton, “Compliant double helix interconnects for high frequency applications,” presented at IEEE ECTC 2014, Orlando, FL, May 27-30, 2014. doi: 10.1109/ECTC.2014.6897424
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S. Hussain, R. C. Jaeger, J. C. Suhling, B. M. Wilamowski, M. C. Hamilton, P. Gnanachchelvi, “Understanding the Impact of Temperature Variations on Measurement of the Stress Dependent Parameters of Bipolar Junction Transistors,” presented at 14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, May 27-30, 2014. doi: 10.1109/ITHERM.2014.6892423
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J. Gess, S. Bhavnani, K. A. Moores, B. Ramakrishnan, R. W. Johnson, D. Harris, R. Knight, M. Hamilton, C. Ellis, “Impact of Surface Enhancements upon Boiling Heat Transfer in a Liquid Immersion Cooled High Performance Small Form Factor Server Model,” presented at 14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, May 27-30, 2014. doi: 10.1109/ITHERM.2014.6892314
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F. Yu, R. W. Johnson, and M. Hamilton, “Pressureless, Low Temperature Sintering of Micro-scale Silver Paste for Die Attach for 300 °C Applications,” presented at IMAPS HiTEC, Albuquerque, NM, May 13-15, 2014. Best Paper! doi: 10.4071/HITEC-WA21
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Z. Shen, R. W. Johnson, and M. Hamilton, “Characterization of BiAgX Solder Paste on Thick Film for 200 °C Applications,” presented at IMAPS HiTEC, Albuquerque, NM, May 13-15, 2014. doi: 10.4071/HITEC-THA23
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M. C. Hamilton, P. Xu, G. Hernandez, M. J. Palmer and C. D. Ellis, “Reworkable Interconnects using Alternative Materials,” presented at IMAPS New England 41st Symposium and Expo, Boxborough, MA, May 6, 2014.
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S. Zou and M. C. Hamilton, “Ink-jet Printed Cu/CuxO/Ag ReRAM Memory Devices Fabricated on Flexible Substrates” presented at the MRS Spring Meeting 2014, San Francisco, CA, April 21-25, 2014. MRS Proceedings, 1692, mrss14-1692-cc11-04. doi: http://dx.doi.org/10.1557/opl.2014.905
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G. A. Hernandez, C. D. Ellis, M. Palmer, and M. C. Hamilton, “Liquid Metal Conductors For Reworkable Electronics,” presented at GOMACTech 2014 , Charleston, SC, March 31 – April 3, 2014.
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F. Tong, B. Ozden, K. Yapabandara, C.-W. Yang, C. Yang, M. Khanal, C. Jiao, M. Goforth, A. Ahyi, M. Hamilton, G. Niu, D.A. Ewoldt, G. Chung and M. Park, “Investigation of AlGaN/GaN heterostructures on Si wafers via photo I-V measurement,” presented at 91st Annual Meeting of the Alabama Academy of Science, Auburn, AL, March 12-14, 2014.
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A. N. Beal, J. Tatarchuk, C. Stevens, T. Baginski, M. Hamilton and R. N. Dean, “Design Considerations and Ring-down Characteristics of Micromachined, High Current Density Capacitors,” presented at IMAPS 10th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 11-13, 2014. Best Student Paper! (2nd) doi: 10.4071/2014DPC-wa32
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J. Gess, S. Bhavnani, K. A. Moores, B. Ramakrishnan, R. W. Johnson, D. Harris, R. Knight, M. Hamilton, C. Ellis, “Investigation and Characterization of a High Performance, Small Form Factor, Modular Liquid Immersion Cooled Server Model,” presented at IEEE 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM), San Jose, CA, March 9-13, 2014. doi: 10.1109/SEMI-THERM.2014.6892208
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P. Xu, A. H. Pfeiffenberger, C. D. Ellis, and M. C. Hamilton, “Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects,” IEEE J. Microelectromech. Syst., vol. 23, no. 5, pp. 1219-1227 (2014). doi: 10.1109/JMEMS.2014.2309121
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S. Hale, A. N. Beal, J. P. Bailey, R. N. Dean, J. K. Tugnait, N. J. Corron and M. Hamilton, “Design considerations for a high-capacity chaotic communications channel,” presented at XXXIII Dynamics Days US, Atlanta, GA, January 2-5, 2014.
2013
F. Tong, K. Yapabandara, C.-W. Yang, M. Khanal, C. Jiao, M. Goforth, B. Ozden, A. Ahyi, M. Hamilton, G. Niu, D.A. Ewoldt, G. Chung, and M. Park, “Spectroscopic photo I–V diagnostics of nitride-based high electron mobility transistor structures on Si wafers,” Electronics Letters, 49 (24), pp. 1547-1548 (2013). doi: 10.1049/el.2013.3404
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R. C. Jaeger, S. Hussain, J. C. Suhling, P. Gnanachchelvi, B. M. Wilamowski, and M. C. Hamilton, “Modeling the Impact of Mechanical Stress on Bipolar Transistor Current Gain and Early Voltage,” presented at IEEE Sensors, Baltimore, MD, November 3-6, 2013. doi: 10.1109/ICSENS.2013.6688466
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E. Decrossas, M. D. Glover, K. Porter, T. Cannon, M. C. Hamilton, and H. A. Mantooth, “Broad Frequency LTCC Vertical Interconnect Transition for MultiChip Modules and System On Package Applications,” presented at European Microwave Week (EuMW2013), Nuremberg, Germany, October 6-11, pp. 104-107, 2013.
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M. Glover, M. Hamilton, E. Decrossas, K. Porter, A. Pfeiffenberger, and A. Mantooth, “A low loss power distribution network design in low temperature co-fired ceramic technology,” in Proceedings of the 46th International Symposium on Microelectronics, IMAPS 2013, Orlando, FL, September 30 – October 3, 2013. doi: 10.4071/isom-2013-WP32
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S. Hussain, P. Gnanachchelvi, J. C. Suhling, R. C. Jaeger, M. C. Hamilton and B. M. Wilamowski, “The Influence of Uniaxial Normal Stress on the Performance of Vertical Bipolar Transistors,” in Proceedings of the InterPACK2013, Burlingame, CA, July 16-28, 2013. doi: 10.1115/IPACK2013-73233
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Z. Shen, K. Fang, M. Hamilton, R. W. Johnson, E. Snipes and M. Bozack, “Lead-free Solder Attach for 200 °C Applications,” in Proceedings of the International Conference on High Temperature Electronics Network (HiTEN 2013), Oxford, UK, July 8-10, pp. 260-267, 2013. doi: 10.4071/HITEN-WA18
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S.A. Hale, J.P. Bailey, A.N. Beal, R.N. Dean, M.C. Hamilton, “Hardware implementation of cellular automata on coupled networks of exactly solvable chaotic oscillators,” 2013 SIAM Conference on Applications of Dynamical Systems, Snowbird, UT, May 19-23, 2013.
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A.N. Beal, J.P. Bailey, S.A. Hale, R.N. Dean, M.C. Hamilton, J.K. Tugnait, D.W. Hahs and N.J. Corron, ”Implementing an exactly solvable chaotic oscillator for chaos communications,” 2013 SIAM Conference on Applications of Dynamical Systems, Snowbird, UT, May 19-23, 2013.
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S. Zou, P. Xu and M. C. Hamilton, “Resistive switching characteristics in printed Cu/CuO/(AgO)/Ag memristors,” Electronics Letters, 49 (13), pp. 829-830 (2013). FEATURED ARTICLE! doi: 10.1049/el.2013.1302
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G. A. Hernandez, S. Patenaude, D. Martinez, C. Ellis, M. Auad, and M. C. Hamilton, “Characterization of AL-X Carbon Resistors,” presented at IMAPS PNGND, Albany, April 30 – May 1, 2013.
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S. Zou, P. Xu, and M. C. Hamilton, “Ink-jet Printed Cu/Ag Memristor,” presented at IMAPS PNGND, Albany, April 30 – May 1, 2013.
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G. A. Hernandez, D. Martinez, C. Ellis, M. Palmer, and M. C. Hamilton, “Through Si Vias Using Liquid Metal Conductors For Re-workable 3D Electronics,” presented at IEEE ECTC, Las Vegas, NV, May 28-31, 2013. doi: 10.1109/ECTC.2013.6575756
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J. Bailey, M. Glover, E. Decrossas, K. Porter, T. Cannon, A. Mantooth, and M. Hamilton, “Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques,” presented at IMAPS CICMT 2013, Orlando, FL, April 23-25, 2013. doi: 10.4071/CICMT-2013-TP23
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B. Caudle, M. Baginski, and M. Hamilton, “Nonlinear Transmission Lines Using Substrate Integrated Waveguides in LTCC,” presented at IMAPS CICMT 2013, Orlando, FL, April 23-25, 2013. doi: 10.4071/CICMT-TP25
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B. Caudle, M. Baginski, H. Kirkici and M. C. Hamilton, “Three-Dimensional FDTD Simulation of Nonlinear Ferroelectric Materials in Rectangular Waveguide,” IEEE Trans. Plasma Science, 41, no. 2, pp. 365-370 (2013). doi: 10.1109/TPS.2013.2239663
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P. Xu and M. C. Hamilton, “Reduced-Loss Ink-Jet Printed Flexible CPW with Copper Coating,” IEEE Microw. Compon. Lett., 23, no. 4, pp. 178-180 (2013). doi: 10.1109/LMWC.2013.2248704
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G. A. Hernandez, D. Martinez, S. Patenaude, and M. C. Hamilton, “Nanostructured Amorphous Silicon on Metal Electrodes: Electrical and Optical Properties,” Proceedings of the 2013 MRS Spring Meeting, San Francisco, CA, April, 2013. MRS Proceedings, 1551, pp 61-66. doi: http://dx.doi.org/10.1557/opl.2013.897
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M. Hamilton, J. Bailey, C. Ellis, M. Palmer, T. Issac-Smith and R. Wayne Johnson, “Redistribution Layers Based on Thin-Film AL-X / Cu and Si Interposers with Cu TSVs for Dense 28Gbps Chip-to-Chip Networks,” presented at GOMACTech 2013, Las Vegas, NV, March 11-14, 2013.
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G. A. Hernandez, D. Martinez, S. Patenaude, C. Ellis, M. Palmer and M. C. Hamilton, “Through Si Vias Using Liquid Metal Conductors for Re-workable 3D Electronics,” presented at IMAPS 9th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March, 2013.
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A. N. Beal, C. Stevens, T. Baginski, M. C. Hamilton and R. N. Dean, “Design, Simulation and Testing of High Density, High Current Micro-machined Embedded Capacitors,” presented at 9th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March, 2013. doi: 10.4071/2013DPC-ta32
2012
P. Xu and M. C. Hamilton, “Indium plated carbon nanotubes pattern on flexible substrate defined by ink-jet printing,” Proceedings of the 2012 MRS Fall Meeting, Boston, Nov., 2012. MRS Proceedings, 1505, mrsf12-1505-w13-12-ww07-12. doi: http://dx.doi.org/10.1557/opl.2013.265
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A. N. Beal, J. P. Bailey, S. A. Hale, R. N. Dean, M. Hamilton, J. K. Tugnait, D. W. Hahs and N. J. Corron, “Design and Simulation of a High Frequency Exact Solvable Chaotic Oscillator,” MILCOM12, October 29 – November 1, 2012. doi: 10.1109/MILCOM.2012.6415803
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M. C. Hamilton, “Recent Advances in Energy Harvesting,” IECON 2012, Montreal, Canada, October, 2012. doi: 10.1109/IECON.2012.6389019
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J. Bailey, A. Pfeiffenberger, C. Ellis, M. Palmer, T. Isaac-Smith and M. Hamilton, “Thin-Film Signal and Power Redistribution Layers Based on AL-X and Cu,” Proc. 45th International Symposium on Microelectronics, IMAPS, San Diego, September, 2012. Best Student Paper! (1st) doi: 10.4071/isom-2012-TP26
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G. A. Hernandez, P. Xu and M. C. Hamilton, “Fabrication and Electrical Characterization of Amorphous Black Silicon on Metal Electrodes,” presented at IMAPS PNGND, Albany, June 14-15, 2012. Best Student Paper! (2nd)
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P. Xu and M. C. Hamilton, “ RF Performance of In-coated CNT Flexible Interconnect,” presented at IMAPS PNGND 2012, Albany, June 14-15, 2012. Best Student Paper! (1st)
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P. Xu and M. C. Hamilton, “In-coated Carbon Nanotubes for Flexible Interconnects,” 8th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March, 2012. doi: 10.4071/2012DPC-tp23
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J. Richard, R. Dean and M. Hamilton, “Testing of Flexible Metamaterials RF Filters Implemented through Micromachining LCP Substrates,” 8th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March, 2012. doi: 10.4071/2012DPC-tp35
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A. Beal, T. Baginski, M. Hamilton, C. Stevens and R. Dean, “Micro-machined High Density Embedded Capacitor Technologies for Silicon Interposers,” 8th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March, 2012. Best Student Paper! (3rd) doi: 10.4071/2012DPC-tp42
2011 and prior
H. Yu, T. Xie, M. Hamilton and B. Wilamowski, “Comparison of Different Neural Network Architectures for Digit Image Recognition,” Proc. IEEE Human System Interaction Conference HSI 2011, Yokohama, Japan, May 19-21, 2011. doi: 10.1109/HSI.2011.5937350
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M. C. Hamilton and J. Kanicki, “Photodischarge characterization of defect states in polyfluorene-based organic field-effect transistors,” in preparation.
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M. C. Hamilton and J. Kanicki, “Continuous and Pulsed Gate Bias Stressing of Polyfluorene-Based Organic Field-Effect Transistors,” in preparation.
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M.C. Hamilton and J. Kanicki, “Time and Temperature Dependance of the Drain Current of PF-based OFETs,” Device Research Conference Digest, 2005. DRC ’05. 63rd , vol.1, no., pp. 139- 140, 2005.
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J. Kanicki, E. Cagin, M. Hamilton, H. Lee and P. Shea, “Organic Field-Effect Transistors for Flat-Panel Displays,” 2005 SID (Society for Information Display) Int. Symposium Seminar Lecture Notes, pp. M-10/1 – M-10/46, 2005 (ISSN 0887-915X).
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M. C. Hamilton, S. Martin, and J. Kanicki, “Thin-film Organic Polymer Phototransistors,” IEEE Transactions on Electron Devices, vol. 51, pp. 877-885, 2004. doi: 10.1109/TED.2004.829619
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M. C. Hamilton and J. Kanicki “Organic Polymer Thin-film Transistor Photosensors,” IEEE Journal of Selected Topics in Quantum Electronics, vol. 10, pp. 840-848, 2004. doi: 10.1109/JSTQE.2004.833972
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M. C. Hamilton, S. Martin, and J. Kanicki, “Field-Effect Mobility of Organic Polymer Thin-Film Transistors,” Chemistry of Materials, vol. 16, pp. 4699-4704, 2004. doi: 10.1021/cm049613r
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M. C. Hamilton, S. Martin and J. Kanicki, “Effect of Illumination on Organic Polymer Thin-Film Transistors,” Mat. Res. Soc. Symp. Proc., vol. 771, pp. 333-338, 2003. doi: 10.1557/PROC-771-L10.17
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S. Martin, M. Hamilton and J. Kanicki, “Source / Drain Contacts in Organic Polymer Thin Film Transistors,” Mat. Res. Soc. Symp. Proc., vol. 771, pp. 163-168, 2003. doi: 10.1557/PROC-771-L6.2
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M.C. Hamilton, S. Martin and J. Kanicki, “Organic Polymer Thin-Film Photo-Transistors,” Proc. of SPIE, vol. 5217, pp. 193-201, 2003. doi: 10.1117/12.504867
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S. Martin, L. Dassas, M.C. Hamilton and J. Kanicki, “Time Dependence of Organic Polymer Thin-Film Transistors Current,” Proc. of SPIE, vol. 5217, pp. 7-15, 2003. doi: 10.1117/12.504536
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S. Martin, M. C. Hamilton, and J. Kanicki, “Organic-polymer thin-film transistors for active-matrix flat-panel displays?,” Journal of the Society for Information Display, vol. 11, pp. 543-549, 2003. doi: 10.1889/1.1825684
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M.C. Hamilton, S. Martin and J. Kanicki, “Effect of Monochromatic Illumination on Organic Polymer Thin-Film Transistors,” IDRC 03 (Int. Display Research Conf.), pp. 14-17, 2003.
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S. Martin, L. Dassas, M. Hamilton and J. Kanicki, “Electrical Instabilities of Organic Polymer Thin-Film Transistors,” IDRC 03 (Int. Display Research Conf.), pp. 22-25, 2003.
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M. C. Hamilton, S. Martin, and J. Kanicki, “Organic Polymer Phototransistors,” Electronic Materials Conference (EMC), 2002.
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J. D. Cressler, M. Hamilton, R. Krithivasan, H. Ainspan, R. Groves, G. Niu, S. Zhan, Z. Jin, C. Marshall, P. Marshall, H. Kim, R. Reed, M. Palmer, A. Joseph, and D. Harame, “Proton Response of SiGe HBT Analog and RF Circuits and Passives,” IEEE Transactions on Nuclear Science, vol. 48, pp. 2238-2243, 2001. doi: 10.1109/23.983202
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J. D. Cressler, M. C. Hamilton, G. S. Mullinax, Y. Li, G. F. Niu, C. J. Marshall, P. W. Marshall, H. S. Kim, M. J. Palmer, A. J. Joseph, and G. Freeman, “The Effects of Proton Irradiation on the Lateral and Vertical Scaling of UHV/CVD SiGe HBT BiCMOS Technology,” IEEE Transactions on Nuclear Science, vol. 47, pp.2515-2520, 2000. doi: 10.1109/23.903801
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